Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/42
Wire connectors; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/44
Structure, shape, material or disposition of the wire connectors prior to the connecting process
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/45
of an individual wire connector
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/456
with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/45663
the principal constituent melting at a temperature of greater than 1550°C
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/45676
Ruthenium (Ru) as principal constituent
Filter patents View analytics View as hierarchy Open in page

H01L2224/45676

Copper wire and electrode joining method and joint structure
09793238 · 2017-10-17 · ·

With this copper wire joining method, a rubbed portion on which a coating remains between an electrode and a core wire is formed on the electrode. Then, after a capillary is moved away from the rubbed portion, and a ball is formed by melting a copper wire at a tip end of the capillary. Next, the ball is joined to the rubbed portion by pressing the ball against the rubbed portion.

Copper wire and electrode joining method and joint structure
09793238 · 2017-10-17 · ·

With this copper wire joining method, a rubbed portion on which a coating remains between an electrode and a core wire is formed on the electrode. Then, after a capillary is moved away from the rubbed portion, and a ball is formed by melting a copper wire at a tip end of the capillary. Next, the ball is joined to the rubbed portion by pressing the ball against the rubbed portion.

COPPER WIRE AND ELECTRODE JOINING METHOD AND JOINT STRUCTURE
20170179075 · 2017-06-22 · ·

With this copper wire joining method, a rubbed portion on which a coating remains between an electrode and a core wire is formed on the electrode. Then, after a capillary is moved away from the rubbed portion, and a ball is formed by melting a copper wire at a tip end of the capillary. Next, the ball is joined to the rubbed portion by pressing the ball against the rubbed portion.

COPPER WIRE AND ELECTRODE JOINING METHOD AND JOINT STRUCTURE
20170179075 · 2017-06-22 · ·

With this copper wire joining method, a rubbed portion on which a coating remains between an electrode and a core wire is formed on the electrode. Then, after a capillary is moved away from the rubbed portion, and a ball is formed by melting a copper wire at a tip end of the capillary. Next, the ball is joined to the rubbed portion by pressing the ball against the rubbed portion.