Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/8338
Bonding interfaces outside the semiconductor or solid-state body
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H01L2224/83498
with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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H01L2224/835
with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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H01L2224/83517
the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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H01L2224/83524
Aluminium [Al] as principal constituent
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H01L2224/83524

CHIP PACKAGE STRUCTURE WITH RING DAM
20240387195 · 2024-11-21 ·

A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over the wiring substrate. The chip package structure includes a first heat conductive structure over the chip package. The chip package structure includes a ring dam over the chip package and surrounding the first heat conductive structure. The first heat conductive structure has a first corner portion and a first protruding portion connected to the first corner portion, and the first protruding portion passes through the ring dam. The chip package structure includes a heat dissipation lid over the first heat conductive structure and the ring dam.

CHIP PACKAGE STRUCTURE WITH RING DAM
20240387195 · 2024-11-21 ·

A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over the wiring substrate. The chip package structure includes a first heat conductive structure over the chip package. The chip package structure includes a ring dam over the chip package and surrounding the first heat conductive structure. The first heat conductive structure has a first corner portion and a first protruding portion connected to the first corner portion, and the first protruding portion passes through the ring dam. The chip package structure includes a heat dissipation lid over the first heat conductive structure and the ring dam.

Chip package structure with ring dam
12374561 · 2025-07-29 · ·

A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over the wiring substrate. The chip package structure includes a first heat conductive structure over the chip package. The chip package structure includes a ring dam over the chip package and surrounding the first heat conductive structure. The ring dam has a gap. The chip package structure includes a heat dissipation lid over the first heat conductive structure and the ring dam.

Chip package structure with ring dam
12374561 · 2025-07-29 · ·

A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over the wiring substrate. The chip package structure includes a first heat conductive structure over the chip package. The chip package structure includes a ring dam over the chip package and surrounding the first heat conductive structure. The ring dam has a gap. The chip package structure includes a heat dissipation lid over the first heat conductive structure and the ring dam.