A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. A sensing region is adjacent to the first surface. A temporary cover plate is provided on the second surface to cover the sensing region. The method also includes forming a redistribution layer on the second surface and electrically connected to the sensing region. The method further includes removing the temporary cover plate after the formation of the redistribution layer. The first substrate is bonded to a second substrate and a cover plate after the removal of the temporary cover plate so that the first substrate is positioned between the second substrate and the cover plate. In addition, the method includes filling an encapsulating layer between the second substrate and the cover plate to surround the first substrate.

A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. A sensing region is adjacent to the first surface. A temporary cover plate is provided on the second surface to cover the sensing region. The method also includes forming a redistribution layer on the second surface and electrically connected to the sensing region. The method further includes removing the temporary cover plate after the formation of the redistribution layer. The first substrate is bonded to a second substrate and a cover plate after the removal of the temporary cover plate so that the first substrate is positioned between the second substrate and the cover plate. In addition, the method includes filling an encapsulating layer between the second substrate and the cover plate to surround the first substrate.

A light emitting device includes a carrier, at least one epitaxial structure, at least one buffer pad and at least one bonding pad. The epitaxial structure is disposed on the carrier. The buffer pad is disposed between the carrier and the epitaxial structure, wherein the epitaxial structure is temporarily bonded to the carrier by the buffer pad. The bonding pad is disposed on the epitaxial structure, wherein the epitaxial structure is electrically connected to a receiving substrate by the bonding pad.

A light emitting device includes a carrier, at least one epitaxial structure, at least one buffer pad and at least one bonding pad. The epitaxial structure is disposed on the carrier. The buffer pad is disposed between the carrier and the epitaxial structure, wherein the epitaxial structure is temporarily bonded to the carrier by the buffer pad. The bonding pad is disposed on the epitaxial structure, wherein the epitaxial structure is electrically connected to a receiving substrate by the bonding pad.

This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each of the chip areas comprising a sensing device and a plurality of conductive pads adjacent to the sensing chip nearby the first top surface; providing a cap wafer having a second top surface and a second bottom surface opposite to each other, and bonding the second surface of the cap wafer to the first top surface of the sensing device wafer by sandwiching a first adhesive layer therebetween; providing a temporary carrier substrate, and bonding the temporary carrier substrate to the second top surface of the cap wafer by sandwiching a second adhesive layer therebetween; forming a wiring layer connecting to each of the conductive pads on the first bottom surface of the sensing device wafer; providing a first protective layer on the wiring layer; removing the temporary carrier substrate and the second adhesive layer; forming a second protective layer on the second top surface; removing the first protective layer; scribing the chip areas to generate a plurality of individual chip scale sensing chip package; and removing the second protective layer.

This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each of the chip areas comprising a sensing device and a plurality of conductive pads adjacent to the sensing chip nearby the first top surface; providing a cap wafer having a second top surface and a second bottom surface opposite to each other, and bonding the second surface of the cap wafer to the first top surface of the sensing device wafer by sandwiching a first adhesive layer therebetween; providing a temporary carrier substrate, and bonding the temporary carrier substrate to the second top surface of the cap wafer by sandwiching a second adhesive layer therebetween; forming a wiring layer connecting to each of the conductive pads on the first bottom surface of the sensing device wafer; providing a first protective layer on the wiring layer; removing the temporary carrier substrate and the second adhesive layer; forming a second protective layer on the second top surface; removing the first protective layer; scribing the chip areas to generate a plurality of individual chip scale sensing chip package; and removing the second protective layer.