A method of transferring functionalized graphene comprising the steps of providing graphene on a first substrate, functionalizing the graphene and forming functionalized graphene on the first substrate, delaminating the functionalized graphene from the first substrate, and applying the functionalized graphene to a second substrate.

A monolayer film of nanoparticles can formed from a fluid mixture by combining nanoparticles dispersed in water with a water-miscible organic solvent and a molecular ligand comprising a head group with affinity for the nanoparticle, and introducing the fluid mixture to a substrate in the presence of an air/fluid interface, thereby causing a monolayer film of nanoparticles to form on the substrate. Such monolayers films can include metallic nanoparticles such as gold, and possess substantially uniform spacing over at least a one centimeter length scale. The films are metasurfaces effective to cause a range of linear refractive index of from around unity at 700 nm to 10 at 1500 nm. Such metasurfaces might find utility, for example, as ultrafast (picosecond scale) switches at wavelengths useful for telecommunications.

A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.

A label assembly including one or more dissolvable thermal direct adhesive labels and methods of assembly and use. According to one embodiment, each label includes a base layer, a thermal direct layer, an adhesive layer, and a barrier layer. The base layer, which has an upper surface and a lower surface, is water-dissolvable and may be made of a water-dissolvable paper. The thermal direct layer is positioned directly over the upper surface of the base layer and functions in the conventional manner to produce markings therein in response to heat. The adhesive layer is water-dissolvable and is positioned below the lower surface of the base layer. The barrier layer, which is positioned directly below the lower surface of the base layer and directly over the adhesive layer, serves to prevent migration of the adhesive layer through the base layer and into contact with the thermal direct layer.

A thin ribbon spirally wound polymer conduit and method of forming, wherein a helical reinforcing bead is interposed adjacent overlapping layers of ribbon. Further, a method of continuously forming spirally wound conduit wherein a sacrificial layer, preferably having a different base polymer to that of the conduit, is first applied to the former before the conduit is formed overtop.

Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

A label affixing machine includes a holder, a storing device, a storing device, a peeling device and a conveyer. The storing device, the peeling device and the conveyer are fixed in position on the holder. The picking device is coupled to the conveyer. The label includes a bottom board affixed under the label, the label affixing machine configured to affix the label on an object. The picking device is configured for picking the label. The peeling device includes a second fixing module fixed in position on the holder, a second moving module coupled to the second fixing module and a robotic arm fixed in position on the second moving module. The robotic arm is configured for clamping the bottom board and peeling the bottom board from the label. The conveyer moves the picking device and affixes the label on the object.

A temporary adhesive is good peelability, heat resistance and cleaning removability after polishing of the rear surface of the wafer. A layered body for processing a rear surface of a wafer opposite to a circuit surface of the wafer, the layered body being a temporary adhesive loaded between a support and circuit surface of the wafer and including an adhesive layer (A) that includes a polyorganosiloxane to be cured by a hydrosilylation reaction and is releasably bonded, and a separation layer (B) includes a polyorganosiloxane and is releasably bonded, in which the polyorganosiloxane forming the separation layer (B) is a polyorganosiloxane containing a siloxane unit of RRSiO.sub.2/2 (provided that each R is bonded to a silicon atom as a SiC bond), and at least one R is an aralkyl group, epoxy group, or phenyl group. Methods for producing and separating these layered bodies and composition for forming the separation layer.

A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a first substrate. The spreading layer has at least one monolayer. A stressor layer is formed on the spreading layer. The stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein at least the closest monolayer remains on the stressor layer. The at least one monolayer is stamped against a second substrate to adhere remnants of the two-dimensional material on the at least one monolayer to the second substrate to provide a single monolayer on the stressor layer. The single monolayer is transferred to a third substrate.