Patent classifications
Y10T29/4935
Spacecraft with anti nadir battery radiator
A satellite is disclosed comprising an anti-nadir panel having a first side and a second side. In one or more embodiments, the first side of the anti-nadir panel is mounted to an anti-nadir side of the main body of the satellite. The satellite further comprises at least one battery pack mounted to the second side of the anti-nadir panel, where at least one battery pack comprises at least one battery cell.
Method for producing membrane wall, pipe bending device for manufacturing transfer duct and method for manufacturing transfer duct using same
Disclosed is a method for producing a cylindrical membrane wall including a plurality of tubes having a coolant passing through an inner part thereof. The method includes producing a plurality of sub-bundles by welding a plurality of tubes to each other after longitudinally arranging the tubes to be adjacent to each other in parallel, producing a plurality of panel-type bundles by welding the sub-bundles to each other, forming a plurality of curved bundles having a curved surface of a predetermined curvature by pressing the panel-type bundles, and welding the curved bundles to each other using a jig.
Sacrificial aluminum fins for failure mode protection of an aluminum heat exchanger
A method of localized cathodic protection of a heat exchanger, includes providing at least one fin formed from a first metal alloy; applying a sacrificial layer of a second metal to at least one region in the at least one fin; and connecting a refrigerant tube to the at least one fin; wherein the sacrificial layer of the second metal includes a metal from one of a zinc alloy or a magnesium alloy.
Collector plate for a heat exchanger manifold
A heat exchanger of a type with a collector plate which has a wall in which are formed rim holes which can receive the ends of tubes of a bundle, wherein the wall of the collector plate is designed such that, for the purpose of a soldered or welded connection to the tubes, it forms collars around the rim holes, and wherein the wall has a front side facing toward the tube bundle and a rear side facing toward the collecting tank. Each collar extends in the direction of the collecting tank from a straight base plane on the rear side of the wall.
Fermentation temperature management
A portable assembly for cooling the contents of a fermentation vessel is provided. In one embodiment, the assembly comprises an insulated, cylindrical enclosure having a fixed bottom and a removable lid. A flexible heat exchanger is cylindrically disposed within the enclosure and encircles the fermentation vessel. In one embodiment, the flexible heat exchanger is connected to a vessel containing thermally conductive fluid by flexible tubes that extend outside the enclosure. In one embodiment, a heating element is used to heat the fermentation vessel.
Alternative-fuel gas orifice having principal-fuel gas orifice temperature profile and a heating, ventilation and air conditioning system incorporating the same
An alternative-fuel gas orifice, a gas furnace configured to employ the same and a method of designing a gas orifice. In one embodiment, the gas orifice includes: (1) a body having an aperture extending therethrough and including: (1a) a metering neck having a cross-sectional area such that a given flow rate of a gas is established when the gas is delivered to the gas orifice at a given alternative-fuel delivery pressure and (1b) a diffuser having a cross-sectional area larger than the cross-sectional area of the metering neck and a length such that the gas achieves a substantially laminar flow before exiting the diffuser.
COOLING METHODS FOR ELECTRONIC COMPONENTS
A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.
Process for making an apparatus with fluid-flow-through cooling of circuit boards
A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.
Electrolysis prevention device and method of use
An electrolysis prevention device, for preventing corrosion caused by electrolysis, includes a sacrificial anode made of an active metal and an anode holder supporting the sacrificial anode. The holder is adapted to fit around the inlet connection of an engine heat exchange component, such as a radiator or heater core, in such a way as to allow for a hose to be attached overtop the device. The device may be included in an originally-manufactured engine heat exchange component or may be installed later.
Thermal bridge element and method for the production therof
A flexible, thermal bridge element, particularly for a space flight instrument, a satellite, a transportation device, or a machine component, includes a number of carbon fiber-reinforced plastic (CFK) layers stacked on top of one another. Each of the CFK layers is composed of a plurality of heat-conductive carbon fibers embedded in a matrix. In at least two segments, particularly opposing end segments, the CFK layers are freed of the material of the matrix so that the carbon fibers of a respective CFK layer are exposed in the at least two segments. The exposed segments of the carbon fibers are provided with an associated metallization, by way of which within the framework of a thermally assisted joining process, the bridge element is connected to a thermally conductive connector element.