Heat exchanger, comprising a series of interconnected modules, each module comprising at least part of a water duct and part of a flue duct, wherein at least the parts of the water ducts of successive modules are interconnected, forming at least one continuous water duct through and/or along a number of said modules, wherein water duct parts of two adjacent modules are interconnected by a connector inserted into an opening in at least one of the modules forming a sealing connection.

Various heat sink/circuit board combinations are disclosed. In one aspect, an apparatus is provided that includes a heat sink and plural contact pins coupled to the heat sink. Each of the contact pins is operable to selectively contact at least one of plural ground conductors of a circuit board. A given contact pin may be selectively moved relative to the heat sink to contact or not contact one of the ground conductors to provide the capability of controlling a number and location of ground points of the heat sink.

A heat exchange fill apparatus for use with a cooling tower that employs a support frame assembly. The heat exchange fill apparatus has a media fill pack that is comprised of fill pack media modules wherein a stake, prevents the modules from shifting with respect to one another. The modules are installed in a cooling tower of the like via a hanging fill support.

A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a heat sink on which the base plate is mounted so that the base plate is interposed between the substrate and the heat sink and at least part of the inner region of the base plate contacts the heat sink. The module further includes a stress relief mechanism configured to permit the base plate to bend away from the heat sink in the edge region responsive to a thermal load so that at least part of the inner region of the base plate remains in contact with the heat sink.

Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.

A method of custom manufacturing a flame arrestor includes providing a housing having an interior surface and an exterior surface where the exterior surface of the housing is shaped to fit within a fluid passageway. The method includes forming, using an additive manufacturing technique, a three-dimensional lattice structure by depositing a first material onto the interior surface of the housing in a predetermined pattern. The lattice structure includes a plurality of connected lattice members forming channels extending from a first end to a second end of the three-dimensional lattice structure. An element of a second material is provided adjacent to the three-dimensional lattice structure. The second material is different than the first material and the element is configured to draw heat away from fluid flowing through the plurality of channels.

A method of constructing an air handling unit includes forming an air handling enclosure, mounting a blower in the air handling enclosure, mounting a heat exchanger in the air handling enclosure downstream of the blower, and mounting at least one heating element in the air handing enclosure downstream of the blower. A method of operating an HVAC system includes disposing a heat exchanger downstream of a blower within an enclosure, providing an airflow through the enclosure, and orienting a plurality of fins on the heat exchanger to stabilize the airflow exiting the heat exchanger prior to the airflow contacting an electrically-powered resistive heating element.

A heat exchanger integrated assembly and a manufacturing method thereof are provided. The heat exchanger integrated assembly includes a heat exchanger, a mating portion and an adaptor, wherein the heat exchanger includes a first inlet and a first outlet; the mating portion includes a first side, a second side and a first hole and a second hole passing through the first side and the second side, and the mating portion further includes a first recessed portion formed on the first side and in communication with the first hole; and the adaptor includes a first passage in communication with the first hole and in communication with the first inlet via the first recessed portion, and a second passage in communication with the first outlet via the second hole. The heat exchanger is integrated with other parts and is connected to an expansion valve directly.

A heat transfer cell includes first and second heat transfer plates which have first and second heat transfer areas, and first and second flanges bent from the first and second heat transfer areas so as to have a height difference with respect to the first and second heat transfer areas. The first and second heat transfer plates are joined into a cell body so as to be opposite to each other in a mirror image, and the cell body having a first fluid passage therein, weld lines formed along the first contacting each other and along the second flanges contacting each other, and external recesses formed outside the heat transfer areas for second fluid passages intersecting with the first fluid passage at a right angle.

Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.