The present disclosure relates to atomizers for an aerosol delivery device such as a smoking article. The atomizer may include a liquid transport element and a wire extending along at least a portion of a longitudinal length thereof. The wire may define contact portions configured to engage heater terminals and a heating portion configured to produce heat. The heating portion may include a variable coil spacing. In other atomizers, the wire may extend at least partially through the liquid transport element proximate the contact portions. Related inputs, cartridges, aerosol production assemblies, and methods of forming atomizers are also provided.

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels.

A heat exchanger, particularly for a motor vehicle, having a tube/fin bundle with tubes, through which a coolant can flow, and having at least one manifold into which the coolant, coming out of the tubes, can flow, whereby the at least one manifold has a manifold top part and a manifold bottom part, whereby outwardly extending protrusions, which form a passage geometry for receiving the tubes of the tube/fin bundle, are formed on the manifold top part and the manifold bottom part.

An insulated heat exchanger tube assembly is disclosed herein comprising a heat exchanger tube, an insulating portion form-fitted around the heat exchanger tube, the insulating portion comprising a polymeric foam, and a polymeric film formed over and adhered to the insulating portion. A heat exchanger formed from the tube and a method of forming an insulated heat exchanger tube also are disclosed. The tube assembly is useful in making a heat exchanger that requires minimal floor space and can be efficiently assembled.

An article for magnetic heat exchange comprising a magnetocalorically active phase with a NaZn.sub.13-type crystal structure is provided by hydrogenating a bulk precursor article. The bulk precursor article is heated from a temperature of less than 50° C. to at least 300° C. in an inert atmosphere and hydrogen gas only introduced when a temperature of at least 300° C. is reached. The bulk precursor article is maintained in a hydrogen containing atmosphere at a temperature in the range 300° C. to 700° C. for a selected duration of time, and then cooled to a temperature of less than 50° C.

Vessel assemblies, heat transfer units for prefabricated vessels, and methods for heat transfer prefabricated vessel are provided. A heat transfer unit includes a central rod, and a plurality of peripheral rods surrounding the central rod and connected to the central rod. The plurality of peripheral rods are movable between a first collapsed position and a second bowed position, wherein in the second bowed position a midpoint of each of the plurality of peripheral rods is spaced from the central rod relative to in the first position. The heat transfer unit further includes a heat transfer element connected to one of the plurality of peripheral rods.

Methods of fabricating cooling apparatuses with coolant filters are provided which facilitate heat transfer from an electronic component(s). The method includes providing a cooling apparatus which includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. A coolant loop is also provided coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of channels, wherein the channels are oxidized to form nanostructured titania (NST) coated on the surfaces of the channels, and a vapor cavity, in communication with the plurality of titanium channels, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane

Modular air cooled condenser apparatus and related methods are disclosed. An example mechanical draft modular air cooled condenser includes a first condenser bundle panel, a second condenser bundle panel, a third condenser bundle panel, and a fourth condenser bundle panel. The example condenser also includes a fan positioned to create a draft to flow over the first, second, third, and fourth condenser bundle panels.