An assembled blank may include a blank tip attached to a blank base, e.g., the blank tip may be welded to the blank base. The blank tip may be manufactured by modifying flat stock, e.g., tiers of blank tips may be manufactured by modifying tiers of flat stock. The blank tip may comprise a first forceps jaw, a second forceps jaw, and a blank tip aperture. The assembled blank may be disposed within a hypodermic tube and an actuation structure of a microsurgical instrument.

A method for repairing bucket which saves time in maintenance operations, wherein the bucket is cut by separating it into two parts, an upper part which is maintained and repaired, and an original bottom one, which is retired replacing it once the repairs of the top are completed with a new bottom part. Repairs are made at the top which has been maintained, and once said repairs are finished the top is welded to the new bottom. The original door is removed and replaced by a new door or a previously repaired one which is kept in Stock. Accessory parts and the new door are mounted and the corresponding tests are done to obtain a new reconditioned bucket.

A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is deposited within the via holes to form vias. A first buildup dielectric layer is formed on the encapsulation. Laser-ablated artifacts are laser-ablated in the first buildup layer. The laser-ablated artifacts in the first buildup layer are filled with a first metal layer to form a first electrically conductive pattern in the first build up layer. The operations of forming a buildup layer, forming laser-ablated artifacts in the buildup layer, and filling the laser-ablated artifacts with an electrically conductive material to form an electrically conductive pattern can be performed any one of a number of times to achieve the desired redistribution.

A production method for a wafer equipped with transparent plates includes: formation of a row of through-holes in a wafer; formation of at least one strip-shaped recess in a wafer surface, each of the through-holes of the same row intersecting partly with the respectively associated strip-shaped recess; an uninterrupted groove being formed in each intermediate region between two adjacent through-holes of the same row, the floor surface of the groove being oriented so as to be inclined relative to the wafer surface by an angle of inclination greater than 0 and less than 90; and covering at least one through-hole with at least one transparent plate made of at least one material transparent to at least a sub-spectrum of electromagnetic radiation.

The present invention refers to an oxygen separation device (12, 14) for a pressure swing adsorption system. In order to provide at least one of improved maintenance behavior, longer lifetime and improved energy consumption, the oxygen separation device (12, 14) comprises a gas inlet (18, 22) at a primary side for guiding a flow of oxygen comprising gas into the oxygen separation device (12, 14) and a gas outlet (28, 30) at a secondary side for guiding a flow of oxygen enriched gas out of the oxygen separation device (12, 14), an oxygen separation membrane (78) comprising an oxygen separation sorbent being capable of separating oxygen from an oxygen comprising gas by sorbing at least one component of the oxygen comprising gas apart from oxygen, and a support structure (80) for supporting the oxygen separation membrane (78), wherein the support structure (80) comprises a plurality of support bars (82) being fixed to the oxygen separation membrane (78). The invention further relates to an oxygen separator (10) and to a method of generating an oxygen separation device (12, 14) for a pressure swing adsorption system.