A film peeling device preventing deformation or other defect of substrates occurring in the process of conveying films adhered up to the substrate leading ends while peeling from the substrate, protecting the substrate from damage, and avoiding deterioration of the substrate quality. The constitution is composed of a substrate holding mechanism for holding the leading end of a substrate by linear contact, an adhering and peeling mechanism for peeling films by an adhesive force from the substrate held by the substrate holding mechanism, a film holding tool for gripping individually the leading ends of the films adhered to the substrate both sides being wound and lifted by the adhering and peeling mechanism, a film conveying unit drive mechanism for conveying the film holding tool gripping the films in the substrate opposite direction conveying direction, and a recovery container accommodating the films being gripped and conveyed by the film holding tool.

A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.

A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.

A tool for removing carpet from a floor. The carpet removal tool includes a panel having an elongated opening thereon. Opposing ends of the panel include handles pivotally affixed thereto to be grasped by one or more users, wherein the handles can be positioned parallel to or perpendicular to the panel. In operation, the user cuts a portion of the carpet to be removed and secures the end of the carpet within the elongated opening on the panel. The user then pulls using the handle so that the carpet wraps around the panel as it is removed from the floor. The carpet can be manually wrapped around the panel by the user.

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film.

An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

A substrate peeling apparatus includes a support member and absorption pads. The support member, having a quadrangular shape, includes first and second vertexes diagonally facing each other in a first direction, and third and fourth vertexes diagonally facing each other in a second direction crossing the first direction. The absorption pads is disposed on the support member. The absorption pads are arranged in rows in a direction parallel to the first direction and at least one absorption pad of each row is arranged in a direction parallel to the second direction. An absorption pad of each row includes a hole having an increasing internal diameter as a distance in the first direction between the each row and the first vertex increases. An internal diameter of an absorption pad in a row positioned halfway between the first and second vertexes has a maximum internal diameter.

New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.