A method for making a composite substrate circulator comprising disposing a plurality of sleeves about a plurality of rods, disposing the plurality of rods and the plurality of sleeves in a plurality of openings in a block to form an assembly, and dividing the assembly to form a plurality of plates. The magnetic saturation (4PiMs) values of the rods and sleeves are chosen to decrease radially (rod has the highest 4PiMs). In addition, a method for making a composite substrate circulator component can include disposing a sleeve about a rod, and disposing the rod and the sleeve in an opening in a block to form an assembly. The rod and/or the sleeve can have a plurality of longitudinally spaced recesses. Additionally, the method can include dividing the assembly at the longitudinally spaced recesses to form a plurality of plates.

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

The present invention provides a piezoelectric quartz crystal resonator and a method for fabricating the same. The piezoelectric quartz crystal resonator comprises a circuit board, a quartz crystal resonator, and a thermistor; wherein, the thermistor is configured to detect a temperature of the quartz crystal resonator, the thermistor and the quartz crystal resonator are arranged on the circuit board and interconnected with each other via electric wires arranged on the circuit board; the thermistor and the quartz crystal resonator are sealed independently from each other by thermoplastic material, and the thermoplastic material sealing the thermistor is in contact with the thermoplastic material sealing the quartz crystal resonator.

A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.

A method of manufacturing an electronic component includes the steps of: preparing a first block formed by stacking a plurality of green sheets serving as an element body; cutting the first block in a first direction into a plurality of second blocks such that a portion of an internal conductor connected to an external electrode is exposed at a cut surface; and cutting each of the plurality of second blocks in a second direction crossing the first direction such that the internal conductor exposed at each of both cut surfaces is located in the center of a portion serving as each element body in the first direction in each of the plurality of second blocks.