A tool for removing a fastener head from a fastener includes a body that includes an alignment surface configured to couple substantially flush against a structural surface proximate the fastener head. A blade coupled to the body includes a tip configured to sever the fastener head from the fastener as the blade is moved in a first direction generally parallel to the alignment surface from a first blade position to a second blade position. The tool also includes a force transfer member coupled to the body for movement parallel to a longitudinal axis of the force transfer member. The longitudinal axis is oriented at an acute angle with respect to the first direction. The force transfer member is configured to move the blade from the first blade position to the second blade position in response to an impulse received by the force transfer member.

A support core includes a tube body for holding a device in an expanded state, a low-friction film disposed over an outer surface of the tube body, and a fixing device for holding the film in place, the fixing device comprising a loop of tape wrapped longitudinally over the film and through the tube body, or a tab on the film that is affixed to the tube body. To remove the tube body, the tape and/or film are cut so that the film can slide towards the front end of the tube body, and the tube body is then pulled out of the device.

Determining at least one stripping parameter for stripping a cable containing a conductor by: a) cutting an insulation up to a cutting depth of a cable with at least one stripping knife, wherein an initial cutting depth is selected to be the cutting depth, which ensures that the at least one stripping knife comes in contact with the conductor; b) stripping the cut insulation by moving the at least one stripping knife in a longitudinal direction in relation to the cable; c) determining by a detecting unit whether the at least one stripping knife has come in contact with the conductor in the step a); and d) repeating the steps a) to c), wherein in each case the cutting depth is reduced by a cutting feed value until a conductor contact can no longer be determined, whereby the stripping cutting depth is maintained in a parameter determination phase.

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

An end effector usable with a surgical instrument includes a first jaw pivotably coupled to a second jaw. The first jaw includes staple forming depressions. A staple cartridge is releasably attachable to a channel of the second jaw. A plurality of staples is disposed in the staple cartridge. A shipping wedge is releasably attached to the staple cartridge. The shipping wedge maintains the staples in their respective retention slots and is usable to separate the staple cartridge from the channel of the second jaw.

An end effector usable with a surgical instrument includes a first jaw pivotably coupled to a second jaw. The first jaw includes staple forming depressions. A staple cartridge is releasably attachable to a channel of the second jaw. A plurality of staples is disposed in the staple cartridge. A shipping wedge is releasably attached to the staple cartridge. The shipping wedge maintains the staples in their respective retention slots and is usable to separate the staple cartridge from the channel of the second jaw.

A tool for removing a fastener head from a fastener includes a body that includes an alignment surface configured to couple substantially flush against a structural surface proximate the fastener head. A blade coupled to the body includes a tip configured to sever the fastener head from the fastener as the blade is moved in a first direction generally parallel to the alignment surface from a first blade position to a second blade position. The tool also includes a force transfer member coupled to the body for movement parallel to a longitudinal axis of the force transfer member. The longitudinal axis is oriented at an acute angle with respect to the first direction. The force transfer member is configured to move the blade from the first blade position to the second blade position in response to an impulse received by the force transfer member.

A material removal method for removing net wrap or twine from the outer surface of a bale of material. The method comprises the steps of cutting the net wrap or twine material along a length of the bale, placing a first spear (62, 162) of a material wind-up system (60, 160) between the bale and the material, rotating the material wind-up system to wind the net wrap or twine material around the first (62, 162) and a second spear (64, 164) and stripping the material from the first and second spears.

A device is provided for unpackaging components encased between a first tape body and a second tape body of a sealed tape. The device includes a component collection device including a cavity for receiving components falling out of the sealed tape being de-taped. A de-taping device is attached to the component collection device. The de-taping device includes a support base held over the cavity, and a shaft on one side of the support base. The support base with the shaft is configured to enable one of the first tape body and the second tape body to be extendable around the shaft and the support base and to be pullable, such that the first tape body and the second tape body are separated and the components fall out of the sealed tape. The support base may include a through-hole configured for sealed tapes to pass through and to be held.

Disclosed is an apparatus that is configured to separate the frame of a solar panel from the body of the solar panel. The apparatus includes first and second plates that are configured to clamp the body between them. Separating at least a portion of the frame from the body is achieved through the use of one or more separation elements that are collectively configured and arranged to progressively push on a side of the frame.