Y10T156/1132

Peeling apparatus

A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.

Systems and methods for removing a backing from a ply of composite material

A system and method for removing a backing from a ply of composite material is disclosed. The system includes a roller having a roller axis and a roller surface that circumscribes the roller axis. The system also includes an adhesion feature disposed on the roller surface. The system further includes a roller drive to move the roller along a travel path that is perpendicular to the roller axis and to rotate the roller about the roller axis.

SYSTEMS AND METHODS FOR REMOVING A BACKING FROM A PLY OF COMPOSITE MATERIAL

A system and method for removing a backing from a ply of composite material is disclosed. The system includes a roller having a roller axis and a roller surface that circumscribes the roller axis. The system also includes an adhesion feature disposed on the roller surface. The system further includes a roller drive to move the roller along a travel path that is perpendicular to the roller axis and to rotate the roller about the roller axis.

Processing apparatus and processing method of stack

A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

LABEL APPLICATOR WITH LABEL PEELING FUNCTION, ROBOT, AND LABEL PEELING METHOD
20190300221 · 2019-10-03 ·

A label applicator with a label peeling function includes a frame supported by a support machine, a suction unit that is supported by the frame and has a suction pad, a claw member having a sharp tip that is disposed under the suction pad, a moving mechanism that is supported by the frame, and supports the claw member so as to be movable in an up-down direction relative to the suction pad, and a lock device that locks movement of the claw member in the up-down direction relative to the suction pad, in a state where the suction pad is placed on top of and in contact with an end of a label lying on the tip of the claw member.

METHODS FOR PROCESSING A SUBSTRATE

A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

Film stripping device and film stripping method

A film stripping device and a film stripping method are provided. The film stripping device includes a bearing platform and an absorbing member, the bearing platform includes a bearing surface; the bearing surface is configured to bear a plurality of film layers which include a film to be stripped off; the film to be stripped off is a film in the plurality of film layers away from the bearing surface. The absorbing member is disposed above the bearing platform, includes a plurality of first absorbing holes, and is configured to absorb the film to be stripped off.

AUTOMATED COVERSLIPPER AND METHODS OF USE

An apparatus and method for selecting and dispensing coverglasses over specimens on slides for the purpose of viewing specimens through a microscope. The selecting device contains suctioning mechanisms for picking up a coverglass from a stack of coverglasses. It also contains the ability to shape the coverglass to assist in separating and laying down of the coverglasses with a reduction in the creation of bubbles in the fluid.

Glass substrate separation method and glass substrate separation device

Disclosed are a glass substrate separation device and a glass substrate separation method. A plurality of first vacuum adsorption devices is adsorbed on one end of the glass substrate to separate the one end of the glass substrate and an OLED with an opening with a certain distance, and a metal wire is driven to enter the opening, and abuts a lower surface of the glass substrate to move to the other end of the glass substrate to accomplish the separation between the glass substrate and the OLED; and then, a second vacuum adsorption device is adsorbed at an intermediate position of the glass substrate to remove the glass substrate from the OLED to realize a glass substrate removal process after a LLO in an OLED module production, thereby avoiding a damage to the OLED and a PI layer disposed on a surface layer of the OLED.

SEPARATION APPARATUS AND SEPARATION METHOD FOR FLEXIBLE DISPLAY PANEL
20190232634 · 2019-08-01 ·

The present application provides a separation apparatus for a flexible display panel, includes a support post, a power unit and a vacuum suction block; wherein the supporting post is used to support the separation apparatus on the relatively upper side of the rigid substrate to be separated; the vacuum suction block is in communication with the support post, and is used to suck and connect the rigid substrate to be separated; and one end of the power unit is connected to the support post, the other end is rotatably connected with the vacuum suction block, and is used for controlling the vacuum suction block and the rigid substrate to be separated together to be separated from the flexible display panel. The present application also provides a method for separating a flexible display panel.