A wafer de-bonding device comprises a stage (1) for holding a device wafer and a carrier wafer bonded together, and a tool (2) with a gas outlet (2.2) disposed in proximity to the stage (1) through an adjustment device for control the tool (2) to move towards or away from the stage (1), the tool (2) being provided with a bit (2.1) to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet (2.2) being provided on the tool bit (2.1), the tool (2) being further provided with a gas inlet (2.3) in communication with the gas outlet (2.2), the gas inlet (2.3) being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage (2). The wafer de-bonding device has a high degree of automation and simple operations.

A debonding device includes a first member provided with a recess for receiving a carrier body, the carrier body including a first plate, a second plate, and plural semiconductor chips. The semiconductor chips are sandwiched between the first plate and the second plate, the first plate of the carrier body received in the recess being opposed to a bottom of the recess. A second member is configured to change a relative position with respect to the first member, wherein the second member holds the second plate of the carrier body received in the recess using a vacuum suction, and the first member is provided with an inlet to introduce gas into a gap between the first plate and the second plate of the carrier body received in the recess.

A reception device for moving components along a first axis, a second axis and a third axis and that is designed to rotate in a controlled manner relative to a deposit point, at least partly about the third axis containing the deposit point, by means of a rotary drive and/or to be propelled in a controlled manner by means of at least one linear drive at least partly along one of the first, second or third axes, and/or to propel, in a controlled manner, a carrier guided by the reception device, along one of the first and/or second axes.

A component-handling device for removing components from a structured component supply and for storing the removed components at a reception device, where the reception device is newly adjusted after being initially put into operation after the replacement of device components or after maintenance work, in order to comply with the precision requirements when handling the components. The component-handling device has a self-adjustment device which permits it to adjust the device efficiently in terms of time and with high precision without manual intervention by an operator. The self-adjustment device is composed of a multiplicity of optical sensors and a controller. Adaptation of the measurement results acquired by means of the optical sensors using position sensors and property sensors installed originally for component inspection during fabrication gives rise to a high degree of process reliability and at the same time permits device components to be inspected for damage.

In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.

The present invention provides a method for enhancing the specific uptake of a neurotoxin polypeptide into cells, the method comprising: incubating cells susceptible to neurotoxin intoxication with a neurotoxin polypeptide for a time and under conditions which allow for the neurotoxin polypeptide to exert its biological activity, the incubation comprising at least one of the following steps: (i) K.sup.+-mediated depolarization of the cells, (ii) a reduced neurotoxin polypeptide exposition time and/or (iii) agitation of the cells during neurotoxin polypeptide exposition, thereby enhancing the specific uptake of the neurotoxin polypeptide into said cells. In addition, the invention pertains to a method for directly determining the biological activity of a neurotoxin polypeptide in cells, comprising: a) incubating cells susceptible to neurotoxin intoxication with a neurotoxin polypeptide for a time and under conditions which allow for the neurotoxin polypeptide to exert its biological activity, the incubation comprising at least one of the following steps: (i) K.sup.+-mediated depolarization of the cells, (ii) a reduced neurotoxin polypeptide exposition time and/or (iii) agitation of the cells during neurotoxin polypeptide exposition; b) fixing the cells and, optionally, permeabilizing the cells with a detergent; c) contacting the cells with at least a first capture antibody specifically binding to the non-cleaved and neurotoxin-cleaved substrate and with at least a second capture antibody specifically binding to the cleavage site of the neurotoxin-cleaved substrate, under conditions which allow for binding of said capture antibodies to said substrates; d) contacting the cells with at least a first detection antibody specifically binding to the first capture antibody, under conditions which allow for binding of said first detection antibody to said first capture antibody, thus forming first detection complexes and with at least a second detection antibody specifically binding to the second capture antibody, under conditions which allow for binding of said second detection antibody to said second capture antibody, thus forming second detection complexes; e) determining the amount of the first and second detection complexes of step d); and f) calculating the amount of substrate cleaved by said neurotoxin polypeptide in said cells by means of the second detection complexes, thereby determining the biological activity of said neurotoxin polypeptide in said cells.

The present disclosure provides a method and a system for separating a touch panel from a display module of a touch display device. The system includes a carrying unit configured to secure a to-be-processed touch display device, and a disassembling unit configured to soften an adhesive between the touch panel and the display module so as to separate the touch panel from the display module, thereby to disassemble the touch display device secured on the carrying unit.

The present invention relates to an apparatus and a method for simultaneously performing delamination and adhesion processes. The apparatus which simultaneously performs delamination and adhesion processes includes: a lower stage configured to suction and fix a carrier substrate on which a first workpiece is adhered; and an upper stage including a curved main body configured to suction and fix a second workpiece and formed in a shape convex toward the first workpiece, and a driving portion configured to rotate the curved main body such that predetermined portions of the second workpiece sequentially come into contact with corresponding predetermined portions of the first workpiece at a predetermined pressure, adhere the second workpiece to the first workpiece, and delaminate the first workpiece from the carrier substrate during an adhesion process. According to the present invention, the required number of detailed processes and a process time are decreased, a yield is increased, and deformation of a workpiece due to a residual stress generated during the adhesion and delamination processes is minimized by the adhesion and delamination processes being performed simultaneously.

A manufacturing apparatus (10) for manufacturing a semiconductor device includes: a wafer holding device (12), a PU device (14) having a PU head (40) that holds a target chip (100) in a non-contact manner, an energy irradiation device (16) irradiating energy to the target chip (100) from a back surface side of a dicing tape (130) to reduce an adhesive force of the dicing tape (130), and a controller (22). An adhesive layer of the dicing tape (130) is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip (100) by a small distance. The controller (22) controls a position of the PU head (40) so that the target chip (100) and the PU head (40) do not come into contact with each other even if the target chip (100) floats during a takeoff preparation period.

A system, apparatus, and method for removing pressure adhesive indicia, such as labels or stamps, from their backing and affixing the same to a target substrate is provided. The automated process affixes stamps, for example, to the target substrate with both speed and precision of placement. Desired stamps can be selectively removed from a backing, for example, can be placed on variable locations upon the target substrate, and can be affixed in the desired orientation with precise spacing between stamps. The precision of affixation afforded by this system is commensurate with philatelic standards and is suitable for all pressure adhesive indicia where rapid and precise placement is desired for aesthetic or other reasons.