A component-handling device for removing components from a structured component supply and for storing the removed components at a reception device, where the reception device is newly adjusted after being initially put into operation after the replacement of device components or after maintenance work, in order to comply with the precision requirements when handling the components. The component-handling device has a self-adjustment device which permits it to adjust the device efficiently in terms of time and with high precision without manual intervention by an operator. The self-adjustment device is composed of a multiplicity of optical sensors and a controller. Adaptation of the measurement results acquired by means of the optical sensors using position sensors and property sensors installed originally for component inspection during fabrication gives rise to a high degree of process reliability and at the same time permits device components to be inspected for damage.

The present invention relates to an apparatus and a method for simultaneously performing delamination and adhesion processes. The apparatus which simultaneously performs delamination and adhesion processes includes: a lower stage configured to suction and fix a carrier substrate on which a first workpiece is adhered; and an upper stage including a curved main body configured to suction and fix a second workpiece and formed in a shape convex toward the first workpiece, and a driving portion configured to rotate the curved main body such that predetermined portions of the second workpiece sequentially come into contact with corresponding predetermined portions of the first workpiece at a predetermined pressure, adhere the second workpiece to the first workpiece, and delaminate the first workpiece from the carrier substrate during an adhesion process. According to the present invention, the required number of detailed processes and a process time are decreased, a yield is increased, and deformation of a workpiece due to a residual stress generated during the adhesion and delamination processes is minimized by the adhesion and delamination processes being performed simultaneously.

An apparatus and method for selecting and dispensing coverglasses over specimens on slides for the purpose of viewing specimens through a microscope. The selecting device contains suctioning mechanisms for picking up a coverglass from a stack of coverglasses. It also contains the ability to shape the coverglass to assist in separating and laying down of the coverglasses with a reduction in the creation of bubbles in the fluid.

The present disclosure relates to a technical field of solar cells, and more particularly to an independently-driven film separation mechanism. The separation mechanism includes a mounting platform. A plurality of first suction components for sucking the bottom surfaces of wafers respectively are provided on one side of the mounting platform. Each of the first suction components is corresponding to one of the wafers. The mounting platform is provided with a plurality of second suction components for sucking films respectively, each of the films is provided on a top surface of the corresponding wafer. The first suction components and the second suction components are provided in a one to one correspondence, and a suction direction of each of the plurality of first suction components and a suction direction of each of the plurality of second suction components are opposite.

A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.

A peeling method is provided. In a first step, a resin layer is formed over a support substrate, openings are formed along two opposite sides of a periphery of the resin layer in a top view, an element layer is formed over the resin layer and positioned on an inner side than the openings in the top view, and the support substrate and a counter substrate are bonded to each other so that an adhesive layer is in contact with the support substrate in the openings, thereby forming a process member. In a second step, an entire surface of the process member is irradiated with light from the support substrate side. In a third step, a blade is inserted into an end portion of the process member from an interface between the support substrate and the resin layer or from the resin layer, and is made to pass through the openings.

A system for disassembling a display device includes a supporting part facing a window and supporting at least a portion of the window. A window fixing part is disposed on the supporting part and is configured to fix a position of the window with respect to the supporting part. A display panel stopper is positioned above the supporting part and is spaced apart from the supporting part by a predetermined distance. A window pressurizing part is configured to apply pressure to the second region of the window along a first orthogonal to an upper surface of the supporting part. A separating stick is movable along a second direction which intersects the first direction. The separating stick is configured to be inserted between the window and a display panel adhered to the window.

A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.

This application discloses a method of forming a flexible substrate using a detachment apparatus. The flexible substrate includes a debonding region, and one or more edge regions located in proximity to one or more edges of the flexible substrate. The detachment apparatus detaches the one or more edge regions of the flexible substrate from a rigid carrier that is configured to support the flexible substrate device, and detach the debonding region of the flexible substrate from the rigid carrier to which a bottom surface of the debonding region is configured to adhere. Specifically, the detachment apparatus detaches the debonding region by contacting the top surface of the flexible substrate at a plurality of suction locations located on the debonding region of the flexible substrate, and applying detachment force at the plurality of suction locations to peel the flexible substrate off the rigid carrier.

Disclosed are a glass substrate separation device and a glass substrate separation method. A plurality of first vacuum adsorption devices is adsorbed on one end of the glass substrate to separate the one end of the glass substrate and an OLED with an opening with a certain distance, and a metal wire is driven to enter the opening, and abuts a lower surface of the glass substrate to move to the other end of the glass substrate to accomplish the separation between the glass substrate and the OLED; and then, a second vacuum adsorption device is adsorbed at an intermediate position of the glass substrate to remove the glass substrate from the OLED to realize a glass substrate removal process after a LLO in an OLED module production, thereby avoiding a damage to the OLED and a PI layer disposed on a surface layer of the OLED.