Source radio frequency energy (RF) is coupled wirelessly, with no direct physical contact, between two compound loop (CPL) antennas across a variety of barriers such as plastic, human tissues, glass, and air. The compound coupling interface is highly efficient in transferring the RF energy from a source including one CPL antenna to a destination including a second CPL antenna. A re-radiating structure including a further CPL antenna or a different type of antenna may be connected on the destination side to completely physically isolate the source side from the destination side. When the destination coupling antenna is removed, the source coupling antenna may operate as an efficient radiator at the desired operating frequencies. Likewise, the destination coupling antenna may operate as an efficient radiator in the absence of the source coupling antenna.

A system according to one embodiment includes a phased array antenna comprising a plurality of antenna elements, the plurality of antenna elements configured in a planar array, wherein each of the plurality of antenna elements generates a beam pattern directed at an angle out of the plane of the planar array; and driver circuitry coupled to each of the plurality of antenna elements, wherein the driver circuitry comprises a plurality of transceivers, the plurality of transceivers configured to provide independently adjustable phase delay to each of the plurality of antenna elements.

A system includes an antenna array and a transceiver configured to communicate wirelessly via the antenna array. The antenna array includes a substrate having first and second ground plates. The antenna array also includes multiple substrate integrated waveguide (SIW) antenna elements located along an edge of the substrate. The antenna array further includes feed lines configured to provide signals to the antenna elements and receive signals from the antenna elements. Each antenna element includes a waveguide between the first and second ground plates and enclosed by vias through the substrate, where the waveguide has one open edge along the edge of the substrate. The system could include multiple antenna arrays, where each antenna array includes multiple SIW antenna elements and the antenna arrays are located along different edges of the substrate.

An antenna is provided. The antenna includes a substrate having a first end and a second end opposite to the first end, wherein a direction from the first end to the second end is an extending direction of the antenna; a radiating portion; a feed-in conductor; and a ground portion electrically connected to the radiating portion, coupled to the feed-in conductor, disposed on the substrate from the first end along the extending direction, and including a main ground conductor; and a high frequency band bandwidth adjusting conductor extended from the main ground conductor along the extending direction.

A display panel comprises a first substrate and a second substrate which are arranged opposite to each other, and an antenna pattern is formed on the inside or the outside of the first substrate and includes a feed point and a ground point; the feed point is connected with a transceiver in a display device; and the ground point is connected with a ground wire of the transceiver.

A terahertz imager includes an array of pixel circuits. Each pixel circuit has an antenna and a detector. The detector is coupled to differential output terminals of the antenna. A frequency oscillator is configured to generate a frequency signal on an output line. The output line is coupled to an input terminal of the antenna of at least one of the pixel circuits.

A dielectric resonator, an assembly method thereof and a dielectric filter enable are provided. The dielectric resonator includes the dielectric resonant column, the metal cavity, a sealing cover plate and a tuning screw, wherein the dielectric resonant column is located in the metal cavity, the sealing cover plate is located on an upper end face of the metal cavity, and the tuning screw is located on the sealing cover plate. The dielectric resonator also includes an insulating fixed module located between the lower end face of the sealing cover plate and the upper end face of the dielectric resonant column, and the insulating fixed module is high enough to ensure that a pressure is formed between the sealing cover plate and the dielectric resonant column, so that the dielectric resonant column is fixed at the bottom of the metal cavity.

The dielectric resonator includes a sealing cover, a dielectric resonant column, a metal cavity, and an electrically-conductive elastic structure body. The dielectric resonant column is located within the metal cavity, wherein the sealing cover is connected to an upper surface of the dielectric resonant column. The sealing cover is located at the upper end face of the metal cavity and is configured to seal the metal cavity. The metal cavity is provided with a groove at the bottom. The electrically-conductive elastic structure body is located within the groove and is configured to support the dielectric resonant column. The depth of the groove causes a lower surface of the dielectric resonant column to be lower than an inner bottom surface of the metal cavity after the sealing cover seals the metal cavity. A lower end face of the dielectric resonant column is in contact with the electrically-conductive elastic structure body.

A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer and a bottom layer, forming a recess in the top layer and the substrate layer, attaching ends of connection wires to the metal elements, attaching opposite ends of the connection wires to a chip module and sealing the chip module in the recess.

An isolator assembly includes a capacitively-coupled isolator assembly. In some implementations, the capacitively-coupled isolator element may provide multi-band isolation by having an electrically-floating conductive coupling element with a length that is ½ or ¼ of a carrier wavelength. In other implementations, multiple capacitively-coupled elements may be employed to achieve multi-band isolation.