Y10T29/49018

Methods and apparatus for RFID communications in a process control system

Methods and apparatus for RFID communications in a process control system are disclosed. An example apparatus includes a non-volatile memory to be operatively coupled to a field device of a process control system; and a radio-frequency identification tag to be operatively coupled to the non-volatile memory. The non-volatile memory is to store data received from at least one of the field device or a radio-frequency identification writer via the radio-frequency identification tag. The radio-frequency identification tag is to wirelessly transmit the data to a radio-frequency identification reader. The data includes at least one of maintenance information, diagnostic information, or configuration information associated with the field device. The non-volatile memory and the radio-frequency identification tag to be physically coupled to the field device.

Therapy protocol activation triggered based on initial coupling
10918376 · 2021-02-16 · ·

The present disclosure is directed to a control unit for cooperating with an adhesive patch to convey power from a location external to a subject to a location within the subject. The control unit may include a housing configured for selective mounting on the adhesive patch and may further include at least one processor within the housing. The at least one processor may be configured to activate when the housing is mounted on the adhesive patch and to delay, for a predetermined amount of time following activation of the at least one processor, generation of therapeutic control signals for modulating at least one nerve in the subject's body.

Method Of Providing A Single Structure Multi Mode Antenna Having A Unitary Body Construction For Wireless Power Transmission Using Magnetic Field Coupling

A method of providing a single structure multiple mode antenna having a unitary body construction is described. The antenna is preferably constructed having a first inductor coil portion that is electrically connected in series with a second inductor coil portion. The antenna is constructed having a plurality of electrical connections positioned along the first and second inductor coils. A plurality of terminals facilitates connection of the electrical connections having numerous electrical connection configurations and enables the antenna to be selectively tuned to various frequencies and frequency bands.

TRANSPONDER CHIP MODULE WITH MODULE ANTENNA(S) AND COUPLING FRAME(S)
20210056374 · 2021-02-25 ·

A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is open loop. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.

SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE
20210056375 · 2021-02-25 ·

Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

Redox active polymer devices and methods of using and manufacturing the same

The disclosed technology relates generally to apparatus comprising conductive polymers and more particularly to tag and tag devices comprising a redox-active polymer film, and method of using and manufacturing the same. In one aspect, an apparatus includes a substrate and a conductive structure formed on the substrate which includes a layer of redox-active polymer film having mobile ions and electrons. The conductive structure further includes a first terminal and a second terminal configured to receive an electrical signal therebetween, where the layer of redox-active polymer is configured to conduct an electrical current generated by the mobile ions and the electrons in response to the electrical signal. The apparatus additionally includes a detection circuit operatively coupled to the conductive structure and configured to detect the electrical current flowing through the conductive structure.

RFID integrated circuits with antenna contacts on multiple surfaces

Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. A substrate of the RFID IC, or a portion of the IC substrate, electrically couples the first circuit block to at least one of the first and second antenna contacts. The IC includes one or more interfaces or barrier regions that at least partially electrically isolate the first circuit block from the rest of the IC substrate.

Block made of a building material
10876999 · 2020-12-29 · ·

A building structure includes a block of building material and a magnetic circuit buried in the block of building material. The structure also includes a plurality of sensing devices buried in the block of building material. Each sensing device may include a contactless power supplying circuit magnetically coupled with the magnetic circuit to generate a supply voltage when the magnetic circuit is subject to a variable magnetic field.

Foil Laminate Intermediate and Method of Manufacturing
20200403291 · 2020-12-24 ·

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

Metallized smartcard constructions and methods
10867235 · 2020-12-15 · ·

A dual-interface smartcard (SC) having a booster antenna (BA) with coupler coil (CC) in its card body, and a metallized face plate having a window opening for an antenna module (AM) having contact pads (CP) and a module antenna (MA). A compensation loop (CL) may be disposed directly behind a peripheral portion of the booster antenna. The compensation loop may be formed of a conductive material, such as copper, or of ferrite, and may have two free ends or no free ends. Additionally, the window opening may be substantially larger than the antenna module, the face plate may be perforated, ferrite material may be disposed between the face plate and the booster antenna, the coupler coil may be offset from the antenna, and a ferrite element may be disposed in the antenna module between the module antenna and the contact pads.