An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.

An illustrative electronic assembly having an electrical connector therein to ground an electronic component of the electronic assembly to a grounding feature of a printed wiring assembly (PWA) of the electronic assembly. The electronic assembly may include a housing, the PWA, the electronic component and the electrical connector. The electrical connector may be a conductive and resilient extender or connector that may have a first portion connected to the PWA and a second portion extending generally away from the PWA toward the electronic component. The second portion of the electrical connector may be in mechanical and electrical contact with the electronic component.

A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.

A trench (20) is introduced into a carrier (10) for electrical components (30) on a first surface (O10a) of the carrier into the material of the carrier (10). The carrier (10) is cut through by a cut (60) being introduced into the material of the carrier from a second surface (O10b) of the carrier (10), said second surface being situated opposite the first surface. The cut is implemented in such a way that the cut (60) runs through the trench (20) on the first surface (O10a) of the carrier. By providing a trench (20) in the material layers of the carrier (10) which are near the surface, it is possible to prevent material from breaking out of the carrier during the singulation of devices (1, 2).

Embodiments described herein provide capacitance sensing devices and methods for forming such devices. The capacitance sensing devices include a substrate having a central and an outer portion. A plurality of substantially co-planar electrodes are on the central portion substrate. A first plurality of conductors are on the substrate. Each of the first plurality of conductors has a first end portion electrically connected to one of the plurality of electrodes and a second end portion on the outer portion of the substrate. An insulating material is coupled to the second end portions of the first plurality of conductors. A second plurality of conductors are coupled to the insulating material. Each of the second plurality of conductors is electrically connected to the second end portion of at least some of the first plurality of conductors and is insulated from the second end portion of the others of the first plurality of conductors.

A thermometry apparatus includes a distal probe tip having a hollow interior. An insulating support is at least partially disposed within the interior of the distal probe tip. The insulating support is configured to receive at least one of at least one heating element and at least one temperature sensing element. According to one version, the insulating support is a flexible circuit strip configured to receive the at least one heating element(s) to protect the leads from damage and premature breakage.

Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.

A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

A preassembled display system is assembled at a first location by attaching a plurality of display panels to a frame. The preassembled display system is loaded onto a transportation vehicle. Next, the preassembled display system is moved to a second location in a transportation vehicle. The display unit is installed at the second location by attaching the preassembled display system to a mounting unit. A receiver box for providing media to display at the plurality of display panels is attached. The attaching of the receiver box may be performed at the first location and/or at the second location. The plurality of display panels are electrically connected to the receiver box. Again, the electrically connecting may be performed at the first location and/or at the second location.