An integrated circuit package comprising one or more electronic component(s); and one or more substrate(s), including a first substrate and a second substrate, wherein said first substrate including a first cavity on a first surface of said first substrate and a second cavity on a second surface of said first substrate, said second substrate includes a third cavity on a first surface of said second substrate and a fourth cavity on a second surface of said second substrate, said first substrate and said second substrate are stacked and coupled, and said one or more electronic component(s) is/are disposed inside said first cavity of first substrate and said fourth cavity of second substrate.

An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

An integrated circuit package comprising a heat spreader; one or more substrate(s); one or more standoff(s); and one or more electronic component(s). One or more component(s) is/are coupled to a substrate and the substrate maybe coupled to a heat spreader. Standoff(s) are coupled on the heat spreader or substrates forming a cavity, and one or more component(s) and substrate(s) are located inside the cavity.

An electronic package comprising a first substrate that includes a first plurality of substrate vias and one or more cavities, a second substrate that includes a second plurality of substrate vias and one or more cavities, and a standoff substrate(s). The standoff substrate(s)positioned between the first and second substrate, the standoff substrate(s) is affixed to each of the first and second substrate, standoff substrate(s) forms a clearance between the first and second substrate, the standoff substrate(s) comprises an intervening plurality of substrate vias passing through the entire thickness of the standoff substrate(s), and a portion of the second plurality of substrate vias are configured to be or capable of being electrically connected to a portion of the first plurality of substrate vias by way of a portion of the intervening plurality of substrate vias.

An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

An integrated circuit package comprising one or more electronic component(s); and one or more substrate(s), including a first substrate and a second substrate, wherein said first substrate including a first cavity on a first surface of said first substrate and a second cavity on a second surface of said first substrate, said second substrate includes a third cavity on a first surface of said second substrate and a fourth cavity on a second surface of said second substrate, said first substrate and said second substrate are stacked and coupled, and said one or more electronic component(s) is/are disposed inside said first cavity of first substrate and said fourth cavity of second substrate.

A system comprising a plurality of electronic components, wherein said plurality of electronic components including a first component and a second component, and said first component is a security component configured to generate and/or store security key(s); a substrate; one or more standoff substrate(s) comprising of cavity(3ies), wherein said one or more standoff substrate(s) is/are coupled to said substrate, said one or more standoff substrate(s) completely encircles said substrate, said security component is disposed inside said cavity(ies), said security component is coupled to said substrate, said security component is obfuscated by said substrate and said one or more standoff substrate(s), and said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification.

A control device is configured as an information processing apparatus which is used for a mounting apparatus for mounting a component on a board. The control device acquires an image, including at least a reference portion in a state where a component is gripped by a component gripper having a positioning grip portion that grips the component in a positioned state, and having the reference portion that represents a reference position serving as a predetermined relative position to the position of the component gripped by the positioning grip portion, acquires a position of the reference portion based on the acquired image, and acquires a position of the component based on the relative position to the acquired position of the reference portion.

An electronic component mounter is provided which easily detects penetrating portions. An electronic component mounter comprises a holding section configured to hold a board having a penetrating portion penetrating the board in a front-rear direction and into which a lead of an electronic component is inserted; a light section disposed on one face from among the front face and the rear face of the board when the board is held by the holding section and configured to irradiate a light beam, which is direct light or reflected light, on to the board; and a light receiving section disposed on the other face from among the front face and the rear face of the board when the board is held by the holding section and configured to receive the light beam via the penetrating portion.

An integrated circuit package comprising a first substrate having a cavity; a second substrate; and one or more semiconductor device(s) and/or passive component (s) are coupled to the second substrate. The cavity is formed using two opposite side walls of the first substrate where two opposite sides of the cavity are kept open, the one or more semiconductor device(s) and/or passive component(s) is/are electrically coupled using redistribution layers, and the second substrate is located inside the cavity of the first substrate.