Y10T29/49147

Managed connectivity in electrical systems and methods thereof

An electrical connector arrangement includes a storage device coupled to a connector housing. The storage device is configured to store physical layer information pertaining to the electrical connector arrangement. The storage device also has contacts that enable the physical layer information to be read from the storage device by a media reading interface. A connector assembly includes at least one receptacle assembly; a printed circuit board; and a media reading interface.

Method of producing wiring board that includes dual-layered insulating film

A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.

Softening nerve cuff electrodes

A nerve cuff electrode device comprising a cuff body having a smart memory polymer layer with a rigid configuration at room temperature and a softened configuration at about 37° C. The smart memory polymer layer has a trained curved region with a radius of curvature of about 3000 microns or less. A plurality of thin film electrodes located on the smart memory polymer layer. The thin film electrodes include discrete titanium nitride electrode sites that are located in the trained curved region. An exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of about 0.1 mC/cm.sup.2 or greater. Methods or manufacturing and using the device are also disclosed.

PRODUCTION METHOD OF WIRING BOARD AND WIRING BOARD

A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.

Method for Manufacturing Piezoelectric Actuator
20210217950 · 2021-07-15 ·

A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.

Automated assembly sensor cable

An automated assembly sensor cable has a generally wide and flat elongated body and a registration feature generally traversing the length of the body so as to identify the relative locations of conductors within the body. This cable configuration facilitates the automated attachment of the cable to an optical sensor circuit and corresponding connector. In various embodiments, the automated assembly sensor cable has a conductor set of insulated wires, a conductive inner jacket generally surrounding the conductor set, an outer jacket generally surrounding the inner jacket and a registration feature disposed along the surface of the outer jacket and a conductive drain line is embedded within the inner jacket. A strength member may be embedded within the inner jacket.

SOFTENING NERVE CUFF ELECTRODES
20210236810 · 2021-08-05 ·

A nerve cuff electrode device comprising a cuff body having a smart memory polymer layer with a rigid configuration at room temperature and a softened configuration at about 37° C. The smart memory polymer layer has a trained curved region with a radius of curvature of about 3000 microns or less. A plurality of thin film electrodes located on the smart memory polymer layer. The thin film electrodes include discrete titanium nitride electrode sites that are located in the trained curved region. An exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of about 0.1 mC/cm.sup.2 or greater. Methods or manufacturing and using the device are also disclosed.

Softening nerve cuff electrodes

A nerve cuff electrode device comprising a cuff body having a smart memory polymer layer with a rigid configuration at room temperature and a softened configuration at about 37 C. The smart memory polymer layer has a trained curved region with a radius of curvature of about 3000 microns or less. A plurality of thin film electrodes located on the smart memory polymer layer. The thin film electrodes include discrete titanium nitride electrode sites that are located in the trained curved region. An exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of about 0.1 mC/cm2 or greater. Methods or manufacturing and using the device are also disclosed.

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Method for manufacturing piezoelectric actuator

A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.