A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Disclosed is a manufacturing method of a gas sensor. The gas sensor has a plate-shaped sensor element with at least one pair of electrode pads, a separator disposed around the sensor element, and at least one pair of opposed metal terminals held in an insertion hole of the separator and electrically connected at contact regions thereof to the respective electrode pads. The manufacturing method includes mounting the metal terminals in the insertion hole of the separator with use of a mounting jig. The mounting jig has a flat portion interposed between the contact regions of the metal terminals during the mounting of the metal terminals in the separator so as to prevent contact and entanglement of the opposed metal terminals.

This disclosure provide a nanopillar electrode device, comprising a substrate patterned with a plurality of metal pads. The device may further comprise a plurality of nanopillars electrode arrays, wherein each nanopillar electrode array is attached to the substrate above a metal pad and electrically connected to the pad. The device may further comprise and a chamber surrounding the nanopillar electrodes, which can be used for culturing cells of interest for recording action potentials. The nanopillar electrode device may be configured to apply a voltage through the nanopillar electrodes from a voltage source. Nanopillar electroporation may be used to increase the permeability of cell membranes to allow intracellular recording. Also provided are methods of device fabrication, and methods of use.

Disclosed is a manufacturing method of a gas sensor. The gas sensor has a plate-shaped sensor element with at least one pair of electrode pads, a separator disposed around the sensor element, and at least one pair of opposed metal terminals held in an insertion hole of the separator and electrically connected at contact regions thereof to the respective electrode pads. The manufacturing method includes mounting the metal terminals in the insertion hole of the separator with the use of a mounting jig. The mounting jig has a flat portion interposed between the contact regions of the metal terminals during the mounting of the metal terminals in the separator so as to prevent contact and entanglement of the opposed metal terminals.

Methods are provided for making layers with nano- and micro-patterned topographies by laser action or inkjet printing on a first surface. These topographies have a periodicity of 5 nm to 500 m in a first direction in the plane of the first surface. These layers can be used as anisotropically patterned alignment layers in electro-optical devices and generate an orientational order of at least 0.30.

A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.

In accordance with one embodiment, an electrical connector can be mounted to a first printed circuit board to obtain a first current capacity, and the electrical connector can be mounted to a second printed circuit board to obtain a second current capacity that is lower than the first current capacity.

A panel mount connector and method involve a connector shell assembly that is configured to be received in an opening that is defined by a panel with the connector shell defining a through passage. A flexible circuit board is supported within the through passage and defines a first external connection interface at one end for external electrical access from one side of the panel when the connector shell assembly is installed in the panel and at least the first external connection interface is supported for independent movement relative to the connector shell.

A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.

An electrical connector arrangement includes a storage device coupled to a connector housing. The storage device is configured to store physical layer information pertaining to the electrical connector arrangement. The storage device also has contacts that enable the physical layer information to be read from the storage device by a media reading interface. A connector assembly includes at least one receptacle assembly; a printed circuit board; and a media reading interface.