A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.

A manufacturing method of a structure of a thin fan includes providing a plastic material containing a plurality of metal particles and forming a housing from the plastic material. A part surface of the housing is removed, and a layout area and an extended circuit are formed on the housing. One terminal of the extended circuit connects to the layout area. A first signal connecting structure is disposed on the housing. The first signal connecting structure connects to the other terminal of the extended circuit. A metal layer is disposed on the layout area and the extended circuit.

An end effector assembly for use with an electrosurgical instrument is provided. The end effector assembly has a pair of opposing jaw members. Each of the jaw members has a support base, an electrical jaw lead, and a sealing plate coupled to the electrical jaw lead. The sealing plate has a stainless steel layer and an electrically insulative layer.

An electrical plug-type connector consisting of an electrically nonconductive material includes a plug housing with an inner wall and at least one plug-type contact. The inner wall delimits a first space. The at least one plug-type contact has a first end with which contact can be made by a mating plug-type contact, and a second end, which is opposite the first end. The second end is connected to a printed circuit board by solder. The plug housing is moved from the first end in a direction of the second end via the at least one plug-type contact in the axial direction into a predetermined position. In the predetermined position, the plug-type contact has a lack of force-fitting connection transversely to the axial direction. In the predetermined position, the printed circuit board is fixedly connected to the plug housing. In the predetermined position, the first end protrudes into the first space.

A touch panel and its manufacturing method are provided. In the touch panel, a transparent conductive layer is partitioned by a height difference structure into first electrodes, an array of second electrode components and filling blocks. The array of second electrode components is connected serially by an array of conductive bridging lines so as to form several columns of second electrodes.

The present invention relates to a method for providing a reflective coating to a substrate for a light-emitting device, comprising the steps of: providing a substrate having a first surface portion with a first surface material and a second surface portion with a second surface material different from the first surface material; applying a reflective compound configured to attach to said first surface material to form a bond with the substrate in the first surface portion that is stronger than a bond between the reflective compound and the substrate in the second surface portion; curing said reflective compound to form a reflective coating having said bond between the reflective coating and the substrate in the first surface portion; and subjecting said substrate to a mechanical treatment with such an intensity as to remove said reflective coating from said second surface portion while said reflective coating remains on said first surface portion.

A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

A method including providing a contact lead frame comprised of a sheet metal member, where the contact lead frame includes a plurality of first signal contacts and a plurality of second ground contacts, where the first signal contacts have a male termination end with a first effective thickness which is substantially the same as thickness of the sheet metal member, and stamping a male termination end of the second ground contact, located at a same side of the lead frame as the male termination end of the first signal contacts, to form a dual beam structure having a second effective thickness which is larger than the first effective thickness, where two beams of the dual beam structure are generally parallel to each other along a majority of length of the male termination end of the second ground contact.

A tape cast transducer element assembly comprises a tape cast transducer element including a multi-layer piezoelectric stack diced from a sintered piezoelectric body formed from a plurality of thin film tape layers, the film thin tape layers sintered to produce a final density. A conductive film coats select ones of the thin film tape layers such that conductive layers of different polarities are exposed on opposing sides of the multi-layer piezoelectric stack. Electrodes are coupled to the conductive layers. Electrical leads are coupled to each electrode. A head mass is configured to encapsulate a top portion of the stack. A tail mass is configured to encapsulate a bottom portion of the stack. At least one coupling arrangement extends from a top surface of the head mass through the cross-sectional area of the head mass into the tail mass such that the stack is contained in a rigid assembly under compression.

A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.