According to various embodiments, a contact pad structure may be provided, the contact pad structure may include: a dielectric layer structure; at least one contact pad being in physical contact with the dielectric layer structure; the at least one contact pad including a metal structure and a liner structure, wherein the liner structure is disposed between the metal structure of the at least one contact pad and the dielectric layer structure, and wherein a surface of the at least one contact pad is at least partially free from the liner structure, and a contact structure including an electrically conductive material; the contact structure completely covering at least the surface being at least partially free from the liner structure of the at least one contact pad, wherein the liner structure and the contact structure form a diffusion barrier for a material of the metal structure of the at least one contact pad.

A method may involve providing a conductive pattern on a bio-compatible layer. The conductive pattern may include a first conductive layer that comprises a first metal and a second conductive layer that comprises a second metal. The second conductive layer may be over the first conductive layer, and the first metal may be more malleable than the second metal. The method may also include mounting an electrical component to the conductive pattern to provide an electrochemical sensor. The electrochemical sensor may be configured for use in a body-mountable device.

A textile electrode device, for detection of electrophysiological signals from the skin of a subject, having: a substrate designed to be positioned on the skin; at least a first detection electrode arranged on the substrate; and at least a first conducting element, carried by the substrate and electrically connected to the first detection electrode. The first detection electrode has a plurality of textile fibres, including conductive fibres and, optionally, fibres of a super-absorbent material, arranged in a direction substantially orthogonal to an upper surface of the substrate and reciprocally in contact with each other, so as to ensure uniform electrical contact over the entire first detection electrode. In particular, the first detection electrode is obtained by means of the flocking technique.

A manufacturing method of a circuit board and a stamp are provided. The method includes the following steps. A circuit pattern and a dielectric layer covering the circuit pattern are formed on a dielectric substrate. A conductive via connected to the circuit pattern is formed in the dielectric layer. A photoresist material layer is formed on the dielectric layer. An imprinting process is performed on the photoresist material layer using a stamp to form a patterned photoresist layer, wherein the pressing side of the stamp facing the circuit pattern becomes sticky when subjected to pressure so as to catch photoresist residue from the photoresist material layer in the imprinting process. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed.

An encapsulated semiconductor package. As non-limiting examples, various aspects of the present disclosure provide an integrated circuit package comprising a laminate, an integrated circuit die coupled to the laminate, an encapsulant surrounding at least top and side surface of the integrated circuit die, a conductive column extending from the top side of the integrated circuit die to a top side of the encapsulant, and a signal distribution structure on a top side of the encapsulant.

A complex type fusible link which includes an insulative block base including a plurality of cavities; a conductive connecting plate which is integrally embedded in the insulative block base, a part of the conductive connecting plate being exposed to at least one of the cavities; a plurality of fusible elements each of which is accommodated in corresponding one of the cavities and includes a first end which is connected to the part of the conductive connecting plate and a second end; and a plurality of terminals each of which is integrally embedded in the insulative block base and includes a first end which is connected to the second end of corresponding one of the fusible elements and a second end which is exposed from the insulative block base, at least one of the fusible elements includes a fastening portion to which another fusible element is fastened.

A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.