A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging unit capable of imaging the mounting position from a plurality of fields of view, imaging directions of which are different from each other, and a controller that selects a success or failure determination field of view used for success or failure determination of whether or not the component has been mounted at the mounting position from the plurality of fields of view according to a state of a shield around the mounting position.

Embodiments of integrated circuit (IC) assemblies and related techniques are disclosed herein. For example, in some embodiments, an IC assembly may include a first printed circuit board (PCB) having a first face and an opposing second face; a die electrically coupled to the first face of the first PCB; a second PCB having a first face and an opposing second face, wherein the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints; and a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB. Other embodiments may be disclosed and/or claimed.

The invention relates to a method for producing a lighting unit of a vehicle headlight, comprising the following steps: provision of a printed circuit board (1) comprising a plurality of groups (A, B, C) of contact pads (2) for contacting LEDs (3), population of contact pads (2) in the groups (A, B, C) with LEDs (3), wherein the contact pads (2) to be populated are selected according to a desired light function of the respective group (A, B, C), and provision of securing means (A, B, C) for reflectors (A, B, C) on the printed circuit board (1), wherein each securing means (A, B, C) is specifically designed for a reflector (A, B, C) that is adapted to the light function of the respective group (A, B, C).

A bus line LED module includes a printed circuit board on which LEDs are mounted and lens portion formed over the LEDs. A pair of wires is positioned beneath the printed circuit board within a bottom portion assembly to form a top portion assembly. A pair of windows within a bottom portion assembly enables access to a portion of the wires where a metal-to-metal contact to the metal inner portion of the wires is made. A pair of metal connectors extends from the printed circuit board to make metal-to-metal contact with the metal wires. A sealing connection is made between the top portion assembly and the bottom portion assembly.

The present disclosure discloses a secondary screen structure of a display device, a double-sided display device and a method for manufacturing an e-paper screen. The secondary screen structure of the display device includes an e-paper screen and a secondary screen driving unit connected with each other. The e-paper screen includes an e-paper layer, a touch control unit layer and a solar energy unit layer. The e-paper layer is controlled by the secondary screen driving unit to display. The touch control unit layer may input instructions to the secondary screen driving unit. The solar energy unit layer may supply power for the e-paper layer.

A semiconductor laser module 1 has a semiconductor laser device 30 operable to emit a laser beam L having an optical axis along the Z-direction, a collimator lens 40 configured to collimate components of the laser beam L along a direction of a fast axis (Y-direction), and a lens fixture block 50 fixed relative to the semiconductor laser device 30. The lens fixture block 50 has a lens attachment surface 50A perpendicular to the X-direction. An end 40A of the collimator lens 40 along the X-direction is fixed to the lens attachment surface 50A of the lens fixture block 50 with a lens fixation resin 42.

An organic light-emitting display apparatus includes a flexible substrate having a display region and a non-display region located at an outer region of the display region, the non-display region being folded with respect to the display region; at least one organic light-emitting diode (OLED) on the display region of the flexible substrate; and an encapsulation member encapsulating the display region.

An attachment for an electronic communications device including a conducting element that is coated on one side with layers of material and securely affixed to a nonconducting substrate such that the overall dimensions and thickness of the attachment are sufficiently small that it may be attached to a surface of an electronic communications device whilst allowing the use of any protective casing preferred by the user.

A component mounter includes a side; imaging camera that is provided to be integral with the placing head having a plurality of suction nozzles, that moves relatively with respect to the plurality of suction nozzles, and thereby that images, from a side, peripheral regions of front ends of the plurality of suction nozzles, respectively, in order. Incidentally, a component presence/absence determiner (determiner) determines the presence or absence of a component, sucked on the front end of the suction nozzle, based on primary image data obtained by the side imaging camera and the calculator calculates a thickness of the component sucked on the front end of the suction nozzle, based on secondary image data obtained by the side imaging camera.

A component mounting device includes a heater unit which heats a range which is narrower than a movement range of a head which is a partial range of a board using a heater, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.