A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.

An exemplary optical connector assembly may include a substrate of an optical printed circuit board (OPCB) with at least one optical device thereon, the substrate including one or more recesses, an optical connector with one or more alignment members for coupling an end of an optical waveguide to the optical device, and one or more inserts, each having an orifice for receiving one of the one or more alignment members and each arranged to be received in one of the one or more recesses. When assembled, the one or more inserts may be received in the one or more recesses and the one or more alignment members may be received in the orifices of the one or more inserts thereby coupling the optical waveguide to the substrate to form the exemplary optical connector assembly.

A system including at least one inspection machine and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

A component mounting device includes a controller that controls an imaging unit to image a predetermined region during a period from a time point at which a head finishes mounting a component at a mounting position to a time point at which the head completes upward movement from the mounting position, and acquires information about a height of the mounting position based on an imaging result of the predetermined region imaged by the imaging unit. The controller further determines whether or not the component has been successfully mounted at the mounting position based on the acquired information about the height of the mounting position.

A method for aligning a first article relative to a second article. The second article is provided with at least one flexible structure fixed to the second article at one point while the first article includes at least one surface relief marking. A detector measures the interaction between the flexible structure and surface relief marking and generates detector signals relative to that interaction to achieve alignment between the first and second articles.

An external set-up device calculates a shift amount of a supply position of a component which is supplied by a tape feeder that is disposed on the carriage. The storage stores supply position shifting data in which the shift amount of the component supply position is related to a feeder address and a feeder ID. The component mounter compares the feeder ID of the tape feeder with the feeder ID included in the component supply position shifting data which is read from the storage, and, in a case in which the feeder IDs do not match, calculates the shift amount of the component supply position of the corresponding tape feeder and updates the supply position shifting data. The component mounter mounts the components onto a board based on the updated component supply position shifting data.

There are provided an image pickup module manufacturing method and an image pickup module manufacturing device that can align an image pickup element unit with a lens unit at a low cost and with high accuracy. A manufacturing device 200 holds a lens unit 10 on a Z axis so that an x direction is parallel to a direction of gravity; holds an image pickup element unit 20 on the Z axis; changes a z direction position of the image pickup element unit 20 with respect to the lens unit 10, while holding an x-direction position of a lens group 12 at a predetermined position, to pick up an image of a measurement chart 89; and adjusts a position and a tilt of the image pickup element unit 20 with respect to the lens unit 10 on the basis of image pickup signals.

A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming up plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.