A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.

Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.

The invention relates to a heavy-current transformer (12), in particular for a power source (10) in order to provide a welding current of a resistance welding device (1), with at least one primary winding (13) and at least one secondary winding (14) with center tapping, and to a transformer element, a contact plate (29) and a secondary winding (14) for such a heavy-current transformer (12) as well as a method for the manufacturing thereof. For reduction of losses and improvement of efficiency, at least four contacts (20, 21, 22, 23) are provided to form a multi-point contacting, said contacts (20, 21, 22, 23) being formed by four contact faces within which the at least one primary winding (13) and the at least one secondary winding (14) are arranged in a series/parallel connection.

An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

The invention discloses, pickup method, equipment and EMI electromagnetic shielding layer manufacturing method of SiP module. The method for picking up the SiP module comprises the following steps: A nozzle descends to touch the upper surface of the SiP module; the nozzle sucks the SiP module; an air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends and picks up the SiP module.

An electronic control unit includes: a sensor board on which a sensor is mounted; a control board configured to control an operation of each electric component, based on a physical quantity detected by the sensor; and a housing configured to accommodate the sensor board and the control board, wherein: in an internal space of the housing, a first accommodation chamber in which the electric component is accommodated, a second accommodation chamber in which the sensor board and the control board are accommodated in a hierarchical state, and a partitioning portion which partitions between the first accommodation chamber and the second accommodation chamber are formed; and the sensor board and the control board are supported by the partitioning portion, and a rib is protrudingly provided on the partitioning portion.

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

An ultrasound flow meter unit arranged to measure a fluid flow rate with one or more ultrasound transducers (606), and a circuit board (602) with an electronic circuit arranged to operate the ultrasound transducer(s) (106, 306). The ultrasound transducer (606), e.g. in the form of a piezo-electric element, is mechanically fixed to the circuit board (602) by a first electrically conducting fixing means which additionally serve(s) to provide an electrical connection between an electrical terminal of the transducer (606) and the electronic circuit. Hereby a functional flow measurement unit (600) is provided which can be tested prior to assembly with a flow meter housing etc. Preferably, a set of ultrasound transducers (106, 306) are soldered directly onto electrically conducting paths (631) on a surface of the circuit board (602) being in electrical connection with the electronic circuit, e.g. in a single SMT mounting process together with mounting of all other electronic components on the circuit board (602). Through-going openings (630, 640) of the circuit board (602) in the vicinity of these conducting paths (631) serve to provide thermal elasticity. A metal clip soldered to the circuit board (602) may serve to electrically connect a second electrical terminal of the transducer (606) to the electronic circuit.