In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 C. and has a thermal conductivity greater than or about 1 W/m.Math.K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

A connector arrangement includes a plug nose body; a printed circuit board positioned within a cavity of the plug nose body; and a plug cover that mounts to the plug nose body to enclose the printed circuit board within the cavity. The printed circuit board includes a storage device configured to store information pertaining to the electrical segment of communications media. The plug cover defines a plurality of slotted openings through which the second contacts are exposed. A connector assembly includes a jack module and a media reading interface configured to receive the plug. A patch panel includes multiple jack modules and multiple media reading interfaces.

An integrated back light unit includes a light emitting device assembly which contains an optically transparent encapsulant portion which encapsulates at least one light emitting device, and a light guide unit optically coupled to the at least one light emitting device to receive light from the at least one light emitting device. An adhesive material portion can be provided to bond the light emitting device assembly and the light guide unit. Light-scattering particles can be provided in the optical path of the light from the at least one light emitting device to diffuse light and to homogenize the light introduced into the light guide unit. The light-scattering particles and the adhesive material portion can increase the coupling efficiency of the integrated back light unit.

One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 C. and has a thermal conductivity greater than or about 1 W/m.Math.K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Disclosed is a wireless transceiver for a vehicle and a method of manufacturing the same. In a wireless transceiver manufacturing process according to the present disclosure and a method of manufacturing the same, both of the top and bottom sides of a circuit board, on which components are mounted, are encapsulated using a resin material in a state where the circuit board floats in a cavity. A pin configured to support the circuit board is installed and a decoration flat member is fixed to the surface of the circuit board opposite to the side where the pin is installed using double-sided tape. As a result, it is possible to prevent the resin case from being warped by heat generated from the circuit board. In addition, it is possible to omit an existing post-processing process for preventing the damage to the circuit board which may be caused when one side of the circuit board is exposed to the outside as it is. Thus, steps of the manufacturing process and the manufacturing costs can be reduced.

A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

A method for mounting a rigid electrical connector, including selecting an electrical connector that is compatible with a predetermined portable electronic device; forming an aperture through an interface member, wherein the aperture is larger than the electrical connector; selecting an elastomeric potting material that is compatible with both the electrical connector and the interface member; locating the electrical connector in the aperture with a space between the electrical connector and the interface member; introducing the elastomeric potting material in an uncured state into the space between the electrical connector and the interface member; and while maintaining the space between the electrical connector and the interface member, curing the elastomeric potting material in the space therebetween.