A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

An electronics package for an alternator includes a positive carrier member having an inner side and an outer side, a plurality of switches connected to the positive carrier member, and a terminal assembly engaging the positive carrier member. The terminal assembly includes an electrically insulative portion and a plurality of electrical traces attached to the electrically insulative portion. The electrically insulative portion includes a post extending from the inner side to the outer side of the positive carrier member, a first shoulder engaging the outer side of the positive carrier member, and a second shoulder engaging the inner side of the positive carrier member. The second shoulder is provided by a deformed segment of the post. The post, first shoulder, and second shoulder are all formed as a unitary component.

To address limitations of conventional transducers, a phased array transducer is provided with a form factor suitable for packaging into, e.g., an endoscope. A method of manufacture of small packaging transducers is also provided, whereby the overall package size is reduced by electrically connecting signal wires to array electrodes at an angle approximately normal to the array surface, thus largely eliminating the bend radius requirements of conventional printed circuit boards or flex circuits.

A method of making an electronics package for an alternator includes inserting a post of a terminal assembly thorough a hole in an electrically conductive carrier member such that the terminal assembly is positioned on a first side of the carrier member and an end portion of the post extends from a second side of the carrier member. The method further includes deforming the post extending through the hole on the second side of the carrier member such that the terminal assembly engages the second side of the carrier member and the carrier member is connected to the terminal assembly.

To address limitations of conventional transducers, a phased array transducer is provided with a form factor suitable o for packaging into, e.g., an endoscope. A method of manufacture of small packaging transducers is also provided, whereby the overall package size is reduced by electrically connecting signal wires to array electrodes at an angle approximately normal to the array surface, thus largely eliminating the bend radius requirements of conventional printed circuit boards or flex circuits.

A monitoring device suitable for attachment to a surface of a subject, the device having a data collector and a processor. The data collector includes a flexible foil attached to a less flexible socket, where the foil forms a dermal side surface of the data collector for adhesion to a skin surface of a subject to be monitored. To enable communication of electrical signals between the data collector and the processor, the data collector includes a distribution structure formed as a pattern of an electrically conductive material on an outer surface of a foldable sheet. The foldable sheet forms a layer in the flexible foil and having an interface portion which is folded into an aperture in the socket to form a coupling inside the cavity for electrical communication with a matching coupling of the processor when the processor is received in the cavity.

A method of making a stimulation lead includes attaching multiple segmented electrodes to a carrier. Each of the segmented electrodes has a curved form extending over an arc in the range of 10 to 345 degrees. The method further includes attaching conductors to the segmented electrodes; forming the carrier into a cylinder with segmented electrodes disposed within the cylinder; molding a lead body around the segmented electrodes disposed on the carrier; and removing at least a portion of the carrier to separate the segmented electrodes.

A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.