A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

A crimping tool exchange device exchanges a first crimping tool for a second crimping tool, wherein each crimping tool, when at a processing position in a crimping press, produces a crimp connection connecting a conductor end of a cable to a crimp contact. The device includes first and second exchange units retaining the first and second crimping tools respectively. When one of the exchange units is arranged in an exchange position the retained crimping tool can be moved in a first direction between the processing position and the one exchange unit. The first exchange unit is moved linearly from the exchange position in a second direction, and the second exchange unit is moved linearly from the exchange position in a third direction that is different from the second direction, the second direction being at an angle relative to the third direction.

A rotary crimping tool assembly includes a tool housing defining a crimping chamber, and one or more crimp wheels within the crimping chamber. The crimping chamber is configured to receive the portion of the structure in proximity to the crimp wheel(s). The crimp wheel(s) are configured to be pressed into and rotated relative to the portion of the structure to form one or more crimps in the portion of the structure.

A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

Disclosed herein is an electrode terminal connecting member to connect two or more battery cells in series and/or in parallel to each other so as to manufacture a battery cell core pack, wherein the electrode terminal connecting member includes a plate body having a size sufficient to connect electrode terminals of the battery cells arranged in at least 22 matrix to each other, and the electrode terminals of the battery cells are directly coupled to the plate body in a state in which the plate body is not bent.

A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

The press-fitting device has: a base; a rear surface plate; and a vertical operation section and mounts PF terminals having a shoulder section and a PF section to the member to be mounted. Provided on the vertical operation section are: an insertion path wherein a continuous PF terminal body formed by consecutive PF terminals is inserted; a movable feeding means that feeds the continuous PF terminal body along; a dividing means that divides the continuous PF terminal body into individual PF terminals; and a mounting means that mounts the PF terminals to the mounting member. A fixed feeding means is fixed to the rear surface plate in a static state relative to the vertical operation section, and restricts continuous PF terminal body movement that is in conjunction with the vertical operation section. The PF terminals are mounted to the mounting member by the vertical movement of the vertical operation section.

A method of making a stimulation lead includes attaching multiple segmented electrodes to a carrier. Each of the segmented electrodes has a curved form extending over an arc in the range of 10 to 345 degrees. The method further includes attaching conductors to the segmented electrodes; forming the carrier into a cylinder with segmented electrodes disposed within the cylinder; molding a lead body around the segmented electrodes disposed on the carrier; and removing at least a portion of the carrier to separate the segmented electrodes.