Disclosed herein is an implantable electronic device. In one embodiment, the device has a modular header-feedthru assembly and a housing. The modular header-feedthru assembly has a conductor assembly, a feedthru coupled to the conductor assembly, and a polymer header that is injected molded about the conductor assembly and at least a portion of the feedthru. The housing is welded to the feedthru.

The present invention relates to the field of medical devices, and specifically to a packaging structure and a packaging method for a retinal prosthesis implanted chip, including a high-density stimulation electrode component processed by a glass substrate, wherein the stimulation electrode component comprises the glass substrate, and a plurality of stimulation electrodes and a pad structure provided on the glass substrate; the stimulation electrodes are formed through cutting out metal pins on the metal and then pouring with glass; the stimulation electrode component is connected to an ASIC chip; a glass packaging cover is covered on the ASIC chip, the glass packaging cover is provided with a metal feedthrough structure for communicating with the stimulation chip; and the packaging cover covers and encapsulates the pad structure. In the packaging structure of the present invention, the substrate and the packaging cover are both made of a glass material, and thereby enable manufacture of a high-density stimulation electrode array, and the metal feedthrough structure is directly used on the glass cover, which facilitates wiring and achieves good sealing performance of the package cover.

An implant includes a housing that houses circuitry that is electrically coupled to one or more electrodes. The implant includes an antenna that is electrically coupled to the circuitry. The antenna has a pre-treatment state in which the antenna is not shaped to receive wireless power for treating a subject, and a treatment state in which the antenna is shaped to receive wireless power and to anchor the implant with respect to a nerve of the subject. Other embodiments are also described.

Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

A method for producing a head part of an implantable medical device is described, with a head part housing, which has a recess in the form of a blind hole, along which at least one electrically conducting contact ring element, together with an electrically insulating, elastically deformable sealing ring, are joined together in a force fit in a coaxial arrangement and an axial serial sequence under an axial joining force. The method is characterized in that the generation of the joining force between the at least one contact ring element and the sealing ring is executed along the assembly tool by use of means of attachment fitted on both sides of the at least one contact ring element and the sealing ring along the assembly tool, of which at least one means of attachment is axially movably and detachably fixed in an axially secure manner to the assembly tool.

Systems, devices, and methods are discussed herein for wirelessly transmitting power and/or data to an implanted device, such as an implanted electrostimulator device. In an example, the subject matter includes a layered transmitter device with multiple conductive planes and excitation features. The transmitter device can be tuned to identify and apply device parameters for efficient wireless communication with a deeply implanted device. The transmitter is generally configured for midfield powering applications by providing signals that give rise to propagating signals inside of body tissue.

Embodiments herein relate to implantable medical devices including a power subunit with a first biocompatible electrically conductive shell configured for direct contact with an in vivo environment. In some embodiments a lithium anode can be disposed within the first biocompatible electrically conductive shell in direct electrical communication with a feedthrough pin, wherein the feedthrough pin is electrically isolated from the first biocompatible electrically conductive shell. A cathode can also be disposed within the first biocompatible electrically conductive shell and can be in direct electrical communication with the first biocompatible electrically conductive shell. The first biocompatible electrically conductive shell has a positive electrical potential. The implantable medical device further includes an electronics control subunit with a control circuit disposed within a second biocompatible electrically conductive shell. Other embodiments are included herein.

Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

A method of manufacturing a filtered feedthrough assembly for use with an implantable medical device. The method may include gold brazing an insulator to a flange at first braze joint, and gold brazing a plurality of feedthrough wire to the insulator at second braze joints. The method may further include applying a first non-conductive epoxy to the first braze joint, and applying a second non-conductive epoxy to the second braze joint. The method may further include grit blasting a face of the flange, applying a conductive epoxy to the face of the flange, and attaching an EMI filter to the conductive epoxy such that it is grounded to the flange via the conductive epoxy and not via the first braze joint or the second braze joints.