An airtight device includes a tank, a sink and a feedthrough module. The sink is disposed inside the tank, and an opening is formed on the sink. The feedthrough module is disposed on the opening. The feedthrough module includes a base, a sealing component, a covering component, a transmission component and a plurality of fixing components. A groove is formed on the base. A part of the sealing component is disposed inside the groove. The covering component is assembled with the base and adapted to press the sealing component. A plurality of fixing holes is formed on the covering component. The transmission component is assembled with the covering component. The plurality of fixing components is adapted to insert into the plurality of fixing holes and engage with the base for pressing the sealing component by shortening a distance between the base and the covering component.

An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.

The disclosure relates to an implant comprising an electrode connection device and a housing, wherein a cover for closing the housing is formed on the electrode connection device. A method for producing an implant is also disclosed.

An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) comprises a first gold braze sealing an insulator to the ferrule of a glass-to-metal seal (GTMS) and a lead wire that is sealed in a passageway through the insulator by a second gold braze. A circuit board is disposed adjacent to the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization connected to its active electrode plates and a ground end metallization connected to its ground electrode plates. A ground electrical path extends from the ground end metallization of the chip capacitor, through a circuit board ground plate disposed on or within the circuit board, and to the ferrule. An active electrical path extends from the active end metallization of the chip capacitor to the lead wire of the GTMS.

A method of manufacturing a filtered feedthrough assembly for use with an implantable medical device. The method may include gold brazing an insulator to a flange at first braze joint, and gold brazing a plurality of feedthrough wire to the insulator at second braze joints. The method may further include applying a first non-conductive epoxy to the first braze joint, and applying a second non-conductive epoxy to the second braze joint. The method may further include grit blasting a face of the flange, applying a conductive epoxy to the face of the flange, and attaching an EMI filter to the conductive epoxy such that it is grounded to the flange via the conductive epoxy and not via the first braze joint or the second braze joints.

An active implantable medical device (AIMD) has an alumina housing supporting at least two electrodes. A printed circuit board (PCB) assembly resides inside the housing. Two sintered platinum-containing pathways extend through the housing thickness from the electrodes supported on the housing body fluid side surface to a housing device side surface. A device side end of each of the two platinum-containing pathways is in electrical continuity with an electrical contact supported on the PCB to energize the electrodes for providing stimulation therapy to a patient or for sensing biological signals from the patient.

A ceramic subassembly manufactured by a 3D-printing process is described. The ceramic subassembly comprises a ceramic substrate having a sidewall extending to spaced apart first and second end surfaces. At least one via extends through the substrate from the ceramic substrate first end surface to the ceramic substrate second end surface. In cross-section, the via has a square-shape with rounded corners.

An implantable medical device includes a cover assembly and a feedthrough assembly that couples with the cover assembly. The cover assembly receives a connector end of a lead having lead contacts, and aligns the lead contacts with pockets or apertures of the cover assembly. The feedthrough assembly may include feedthrough contacts in the form of feedthrough pins at or above a surface of a feedthrough substrate, or conductive vias on the surface of the substrate. Electrical contacts configured as leaf spring contact assemblies, torsion spring contacts, or torsion spring contact assemblies are permanently attached to the feedthrough contacts. When the cover assembly and feedthrough assembly are coupled, contact tabs of the electrical contacts are positioned in the pockets or apertures of the cover assembly. Upon complete seating of the cover assembly and feedthrough assembly, the contact tabs are compressed into contact with the lead contacts.

The disclosed technology provides systems and methods of communication between implanted medical devices, e.g., implanted pulse generators, and handheld consumer devices, e.g., smartphones, via standard wireless communication protocols, e.g., Bluetooth or Bluetooth Low Energy (BLE) operating in the unlicensed 2.4 GHz frequency band.