Disclosed is a compact venturi scrubber, used for removing undesirable materials from a gas stream, that includes a gas inlet section, a discharge section aligned with the gas inlet section, the discharge section having a base defined by the intersection of the gas inlet section and the discharge section, a diverging interior surface, and a diverging angle defined by the diverging interior surface, a nozzle, and a liquid inlet through which a liquid scrubbing medium is introduced to the nozzle, wherein the nozzle produces a full spray pattern directed towards the base of the discharge section with a sufficiently large discharge angle so that a cross-sectional area of the full spray pattern produced by the nozzle at the point it intersects with the base of the discharge section fully covers, and substantially matches the size and shape of, the cross-sectional area of the base of the discharge section.

A wet scrubber apparatus has a housing with access doors and guides that allow for the installation of self-contained baffle modules. Selected baffle modules can to be inserted, exchanged, removed or left blank (no baffles) within the wet scrubber housing, depending on the desired process. The wet scrubber allows for variable performance and feature-enhancing for a target efficiency and effectiveness. The wet scrubber can incorporate a pump and pipe manifold “fluidizer” design that can spray water or fluid up onto the modules during operation of the wet scrubber to keep collected material off the baffles. Water can be sprayed throughout the modules onto the baffles during operation, or when the scrubber is offline, isolated from the gas to be scrubbed, during a cleaning operation. This water or fluid can come from an outside source or can be piped and valved to recirculate existing scrub water or fluid.

A wet scrubber apparatus has a housing with access doors and guides that allow for the installation of self-contained baffle modules. Selected baffle modules can to be inserted, exchanged, removed or left blank (no baffles) within the wet scrubber housing, depending on the desired process. The wet scrubber allows for variable performance and feature-enhancing for a target efficiency and effectiveness. The wet scrubber can incorporate a pump and pipe manifold “fluidizer” design that can spray water or fluid up onto the modules during operation of the wet scrubber to keep collected material off the baffles. Water can be sprayed throughout the modules onto the baffles during operation, or when the scrubber is offline, isolated from the gas to be scrubbed, during a cleaning operation. This water or fluid can come from an outside source or can be piped and valved to recirculate existing scrub water or fluid.

The device (1) for bringing a gas and a liquid into contact includes an enclosure (E), first means (5) for introducing into the enclosure and circulating therein a gas stream (G), second means (6) for introducing into the enclosure and circulating therein a liquid stream (L) that circulates inside the enclosure (E) in the same direction as the gas stream (G), and means (4A) for mixing the gas stream (G) and the liquid stream (L). These mixing means (4A) are positioned inside the enclosure (E) in the path of the gas stream and liquid stream and are capable of locally deflecting upward, and/or of locally causing to rise, at least one portion of the gas stream and liquid stream, so as to locally create turbulences in the gas stream and in the liquid stream.

The device (1) for bringing a gas and a liquid into contact includes an enclosure (E), first means (5) for introducing into the enclosure and circulating therein a gas stream (G), second means (6) for introducing into the enclosure and circulating therein a liquid stream (L) that circulates inside the enclosure (E) in the same direction as the gas stream (G), and means (4A) for mixing the gas stream (G) and the liquid stream (L). These mixing means (4A) are positioned inside the enclosure (E) in the path of the gas stream and liquid stream and are capable of locally deflecting upward, and/or of locally causing to rise, at least one portion of the gas stream and liquid stream, so as to locally create turbulences in the gas stream and in the liquid stream.

A method and installation for removing a gas from a flow of a gas mixture. A first liquid (82) is introduced in the flow (106) for evaporative cooling and saturation of the gas mixture. Small droplets of a second liquid (84) are provided which are capable of adsorbing and dissolving said gas and of a size small enough not to be sedimented by gravitation and big enough to be centrifugally separated. The small droplets are sprayed into the flow for adsorbing and dissolving said gas into the droplets, and the small droplets are centrifugally separated from the flow.

An apparatus for treating gaseous pollutants includes a gas inlet part, a first treatment unit, a second treatment unit and a non-mechanical flow-guiding device. The gas inlet part includes a gas inlet chamber and at least one guide pipe. The guide pipe communicates with the gas inlet chamber and guides an effluent stream from a semiconductor process to the gas inlet chamber. The first treatment unit is coupled to a bottom end of the gas inlet part and is configured to abate the effluent stream. The non-mechanical flow-guiding device is coupled to the first treatment unit. The flow-guiding device is configured to guide the effluent stream to move toward an opening. The second treatment unit is coupled to the flow-guiding device via the opening, receives the effluent stream from the first treatment unit and further abates the effluent stream.

An apparatus for treating gaseous pollutants includes a gas inlet part, a first treatment unit, a second treatment unit and a non-mechanical flow-guiding device. The gas inlet part includes a gas inlet chamber and at least one guide pipe. The guide pipe communicates with the gas inlet chamber and guides an effluent stream from a semiconductor process to the gas inlet chamber. The first treatment unit is coupled to a bottom end of the gas inlet part and is configured to abate the effluent stream. The non-mechanical flow-guiding device is coupled to the first treatment unit. The flow-guiding device is configured to guide the effluent stream to move toward an opening. The second treatment unit is coupled to the flow-guiding device via the opening, receives the effluent stream from the first treatment unit and further abates the effluent stream.

Disclosed is an apparatus for collecting a by-product in a semiconductor manufacturing process, the apparatus including: a heating jacket provided detachably along an outer circumference of a housing unit to provide a uniform temperature in a space into which exhaust gas containing tungsten hexafluoride (WF6) discharged after being used in a semiconductor manufacturing process flows; an upper internal collecting tower having first collecting plates and second collecting plates alternately arranged at regular intervals in a vertical direction to realize sufficient moving path and time in a narrow space; and a lower internal collection tower having third collecting plates arranged at regular intervals in the vertical direction, the third collecting plates having different regions on each surface thereof such that each of the third collecting plates is misaligned with a next third collecting plate to realize sufficient moving path and time in a narrow space.

Disclosed is a method for the removal of soluble particulate matter from a gas stream, such as urea dust from the off-gas of a finishing section of a urea production plant. The method comprises subjecting the off-gas to at least two quenching stages an aqueous quenching liquid. The quenching liquid used in a first, upstream quench stage, is allowed to have a higher concentration of dissolved particulate matter than the quenching liquid in the second, downstream quench stage. The quenched gas is led through a particle capture zone, typically comprising one or more of a wet scrubber, a Venturi scrubber, and a wet electrostatic precipitator.