An apparatus for exhaust gas abatement under reduced pressure includes a reaction tube having, in an interior thereof, an exhaust gas treatment space in which an exhaust gas supplied from an exhaust gas source via a vacuum pump is heated by an electric heater or excited by a plasma for decomposition and/or reaction treatment. The apparatus also includes a downstream vacuum pump connected to an exhaust gas outlet located downstream of the reaction tube to reduce a pressure in a region located downstream of an outlet of the vacuum pump and including the interior of the reaction tube. The downstream vacuum pump is a water-sealed pump. The apparatus further includes a water-washing unit for washing a downstream end of an exhaust gas flow path in the reaction tube with washing water. The washing water supplied by the water-washing unit is reused as seal water for the downstream vacuum pump.

An apparatus for exhaust gas abatement under reduced pressure includes a reaction tube having, in an interior thereof, an exhaust gas treatment space in which an exhaust gas supplied from an exhaust gas source via a vacuum pump is heated by an electric heater or excited by a plasma for decomposition and/or reaction treatment. The apparatus also includes a downstream vacuum pump connected to an exhaust gas outlet located downstream of the reaction tube to reduce a pressure in a region located downstream of an outlet of the vacuum pump and including the interior of the reaction tube. The downstream vacuum pump is a water-sealed pump. The apparatus further includes a water-washing unit for washing a downstream end of an exhaust gas flow path in the reaction tube with washing water. The washing water supplied by the water-washing unit is reused as seal water for the downstream vacuum pump.

An apparatus, method and system remove contaminants from a vapor. In an embodiment, a contaminant removal apparatus includes a vacuum box. The vacuum box is a vessel. The apparatus also includes a demister pad disposed in the vacuum box. A vapor is introduced to the vacuum box on an opposing side of the demister pad from a vapor exit from the vacuum box.

A waste peptone disposal system is provided, the system utilizing steam to increase the temperature of the waste peptone and provide active homogenous mixing inside a thermally insulated tank. Steam is introduced through a steam sparging system and directly applied to the waste peptone to reduce noxiousness, allowing the facility to dispose of the processed waste peptone through a wastewater system.

For the purification of waste gas containing carbon compounds and nitrogen oxides by means of a regenerative post-combustion system, at least two regenerators (A, B, C) filled with heat accumulator bodies (7a, 7b, 7c) and connected by a combustion chamber (10) are provided, wherein the waste gas is alternately heated in a regenerator (A, B, C), the carbon compounds are oxidised in the combustion chamber (10), and, with the addition of a nitrogen-hydrogen compound, the nitrogen oxides are reduced in the combustion chamber (10) thermally and thus not catalytically. Remaining nitrogen oxides are removed by means of a catalytically active heat accumulator layer (6a, 6b, 6c) and the addition of a further nitrogen-hydrogen compound in the regenerator (A, B, C) from which the clean gas exits.

The present invention provides an energy-efficient method and apparatus that can achieve exhaust gas abatement with a minimum use of diluent nitrogen gas. More specifically, the present invention is directed to a method and apparatus for exhaust gas abatement under reduced pressure, in which an exhaust gas supplied from an exhaust gas source through a vacuum pump is decomposed by combustion heat of a flame under a reduced pressure.

An apparatus, method and system remove contaminants from a vapor. In an embodiment, a contaminant removal apparatus includes a vacuum box. The vacuum box is a vessel. The apparatus also includes a demister pad disposed in the vacuum box. A vapor is introduced to the vacuum box on an opposing side of the demister pad from a vapor exit from the vacuum box.

A semiconductor waste abatement system for a semiconductor processing system includes a vacuum pump, an abatement apparatus having an abatement chamber in fluid communication with a source of semiconductor waste gas from the semiconductor processing chamber, and with the abatement chamber configured to ionize the waste gas and to exhaust ionized gas. The abatement system further includes a filter apparatus with a filter chamber, which forms a liquid reservoir. The inlet of the filter apparatus is in fluid communication with the outlet of the abatement chamber and the liquid reservoir, and the outlet of the filter apparatus is in communication with the inlet of the vacuum pump, wherein the filter chamber is under a vacuum, and wherein semiconductor waste gas is ionized in the abatement chamber and then filtered by the filter apparatus prior to input to the vacuum pump.

A cylindrical heating unit of an exhaust gas processing device is installed in a reactor. The cylindrical heating unit is provided with an exhaust gas introduction port provided in an insertion base part and a heated exhaust gas outlet provided at insertion end. The cylindrical heating unit includes a hollow cylinder, insulators, electric heaters, and holding members. The hollow cylinder has a double structure with an inner cylinder and an outer cylinder made of metal. A plurality of the insulators surround the inner cylinder and are provided at intervals from each other in a heater installation space between the inner cylinder and the outer cylinder. Electric heaters are mounted to the insulators. The holding members are attached to one of the inner cylinder and the outer cylinder or both and hold the insulators in the heater installation space.

A method of removing buffer gas from a mixture comprising the buffer gas and hyperpolarized noble gas is described. The method includes reacting the buffer gas to produce a reaction product different to the buffer gas. The buffer gas may be reactively removed by one or more of oxidation, reduction, polymerization and binding reactions with solid surfaces. The buffer gas may be molecular hydrogen and/or molecular nitrogen. Apparatus for carrying out the method are also disclosed.