The present disclosure provides embodiments of improved area-selective deposition (ASD) processes and methods for selectively depositing polymer films on a variety of different target material. More specifically, the present disclosure provides improved ASD processes and related methods that use a cyclic vapor deposition process, which sequentially exposes a surface of a substrate to a polymer precursor followed by an initiator to selectively deposit a polymer thin film on a target material exposed on the substrate surface. The process of sequentially exposing the substrate surface to the precursor and the initiator can be repeated for one or more cycles of the cyclic vapor deposition process until a predetermined thickness of the polymer thin film is selectively deposited on the target material. In one embodiment, sequentially pulsed initiated chemical vapor deposition (spiCVD) is used to selectively deposit the polymer thin film on the target material.

A mixed powder usable for a vapor deposition process, including a first organic compound and a second organic compound, wherein the following formula (1) is satisfied:

|θ.sub.1−θ.sub.2|≥10°  (1) where θ.sub.1: a spread angle of a vapor deposition trajectory when a powder consisting of the first organic compound is vapor-deposited on a base material from a vapor deposition source, and θ.sub.2: a spread angle of a vapor deposition trajectory when a powder consisting of the second organic compound is vapor-deposited on a base material from a vapor deposition source.

The present disclosure provides a mask device and a manufacturing method thereof, and an evaporation system. The mask device includes a frame, strip alignment plates and a strip support plate, hollow portions are provided in the strip alignment plates, and the strip alignment plates are fixed on the frame; the strip support plate and the strip alignment plates cross each other, a plurality of welding spots are provided on the surface of the strip support plate proximal to the frame, and are welded and fixed to the frame, and the plurality of welding spots are provided in the region of the strip support plate corresponding to the hollow portions.

A substrate processing method is provided. In the method, a substrate is provided. A monomer that is chemically bonded to the substrate is supplied onto the substrate. An initiator for polymerizing the monomer is supplied to the substrate having the supplied monomer thereon, thereby forming a polymer film.

A surface coating material includes a plurality of fluorine-containing silicon compounds and an additive. The fluorine-containing silicon compounds include a fluorine-containing (poly)ether moiety, a hydrolytic silane moiety, and a linking group between the fluorine-containing (poly)ether moiety and the hydrolytic silane moiety. The linking group is configured to form a non-covalence interaction between adjacent molecules.

Provided is a hard coat laminate having excellent abrasion resistance and heat resistance. The hard coat laminate includes: a substrate; and a base layer disposed on one main surface side of the substrate, in which the base layer contains inorganic nanoparticles, the base layer contains oxygen atoms, carbon atoms, and silicon atoms, the base layer has, on a surface side opposite to the substrate, a first region in which a compositional ratio of carbon atoms to all elements excluding hydrogen decreases as a distance from the substrate increases, in a region other than the first region of the base layer, a compositional ratio of carbon atoms to all elements excluding hydrogen is 5 atom % to 40 atom %, and a compositional ratio of carbon atoms on a surface of the first region is 1 atom % or less.

According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1:

##STR00001## In Chemical Formula 1, L.sub.1 and L.sub.2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R.sub.1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R.sub.2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.

A method of forming a vapour deposited polymeric conformal coating on a surface of a part (23). The method comprises placing the part (23) and a flow control screen in a deposition chamber (22); dispersing a gas into the chamber (22) from which the polymeric coating is deposited on the surface. The flow control screen is spaced apart from the surface and is configured to control a localised flow of the gas in the chamber so as to impose a structure on the deposited coating.

A film forming method includes preparing a substrate having a first region in which a metal film or an oxide film of the metal film is exposed, and a second region in which an insulating film is exposed, supplying, to the substrate, an organic compound containing, in a head group, a triple bond between carbon atoms represented by Chemical Formula (1) described in the specification, causing the organic compound to be selectively adsorbed in the first region among the first region and the second region, and cleaving the triple bond in the first region and forming a hydrophobic film having a honeycomb structure of carbon atoms through polymerization.

The enclosed disclosure relates to a method and apparatus for depositing functionalized nanoparticles within a semiconductor structure in order to create a nano-layer capable of enhancing imaging and contrast, The semiconductor structure can include any type of VNAND structure or 3D structure, The nanoparticles are formed in high-aspect ratio trenches of the structure and form a nano-layer. The functionalized nanoparticles comprise synthesized nanoparticles as well as organic molecules. The organic molecules are chosen to selectively bind to certain nanoparticles and surface materials.