The present invention is in the field of processes for producing flexible organic-inorganic laminates as well as barrier films comprising flexible organic-inorganic laminates by atomic layer deposition. In particular the present invention relates to a process for producing a laminate comprising more than once the sequence comprising: (a) depositing an inorganic layer by performing 4 to 150 cycles of an atomic layer deposition process, and (b) depositing an organic layer comprising sulfur by a molecular layer deposition process.

The present disclosure provides a coating applicator operable to apply a coating of a therapeutic agent upon an object comprising an openable and sealable device compartment, a therapeutic agent positioned in communication with the device compartment, an atomizer operable to atomize the therapeutic agent, and a source of vacuum in communication with the device compartment. The coating applicator may further comprise a drier, and the drier may comprise an arrangement to operate the source of vacuum for a time sufficient to promote drying of applied therapeutic agent. Deposition of the atomized therapeutic agent may be promoted by contacting the atomized therapeutic agent while the object is in a chilled condition and by contacting the object with atomized therapeutic agent while the atomized therapeutic agent is in a heated condition. Related methods are also disclosed.

An organic vapor phase deposition system is provided. The system may include a main reactor defined by a main reactor wail, at least two source barrels configured to introduce at least two organic vapors into the main reactor, and a substrate stage positioned in the main reactor and at least one carrier gas injection line configured to distribute a carrier gas along the main reactor wall, which reduces condensation of the organic vapors onto the main reactor wall as the organic vapors flow toward the substrate stage. A method of fabricating an organic film using organic vapor phase deposition is also provided.

A coating apparatus includes a first vaporizer configured to vaporize a first precursor material, a second vaporizer configured to vaporize a second precursor material in series with the first vaporizer, at least one pyrolysis chamber configured to further process vaporized precursor material from one of the first vaporizer or second vaporizer, and a deposition chamber configured to receive the processed precursor materials.

Systems for depositing coatings onto surfaces of molds and other articles are generally provided. In some embodiments, a system is adapted and arranged to cause gaseous species to flow parallel to a filament array. In some embodiments, a system comprises one or more mold supports that are translatable.

A method of manufacturing self-healing polymer capable of controlling physical properties is provided. The method includes forming the self-healing polymer by adjusting a copolymer composition using monomers of glycidyl methacrylate (GMA) and 2-hydroxyethyl acrylate (HEA) and an initiator of tert-butyl peroxide (TBPO) based on an initiated chemical vapor deposition method (iCVD).

Methods for plasma depositing polymers comprising cyclic siloxanes and related articles and compositions are generally provided. In some embodiments, the methods comprise flowing a precursor gas in proximity to a substrate within a PECVD reactor, wherein the precursor gas comprises an initiator and at least one monomer comprising a cyclic siloxane and at least two vinyl groups, and depositing a polymer formed from the at least one monomer on the substrate.

A method of manufacturing a gas barrier film includes depositing an atomic layer deposition film on a surface of a plastic substrate to form a gas barrier laminate, using atomic layer deposition; depositing a curable resin layer on a support from which the layer is peelable, to form an overcoat laminate; laminating the overcoat laminate to the gas barrier laminate, with the atomic layer deposition film and the curable resin layer facing each other, and transferring the curable resin layer onto the atomic layer deposition film; curing the curable resin layer through application of heat or an active energy beam; and releasing the curable resin layer from the support.

Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

Embodiments of the disclosed subject matter provide methods and systems including a nozzle, a source of material to be deposited on a substrate in fluid communication with the nozzle, a delivery gas source in fluid communication with the source of material to be deposited with the nozzle, an exhaust channel disposed adjacent to the nozzle, a confinement gas source in fluid communication with the nozzle and the exhaust channel, and disposed adjacent to the exhaust channel, and an actuator to adjust a fly height separation between a deposition nozzle aperture of the nozzle and a deposition target. The adjustment of the fly height separation may stop and/or start the deposition of the material from the nozzle.