A cleaning device for cleaning the inside of a monocrystal pulling apparatus includes a main tube part that is capable of being inserted into a pull chamber and a wire cleaning mechanism that is provided at an upper portion of the main tube part and is configured to clean a pulling wire to be inserted into the main tube part. The main tube part includes a continuous extension mechanism that adds together and joins a plurality of joint tube parts in an axial direction and allows the plurality of joint tube parts to be sealed and connected to each other. Accordingly, the cleaning device is configured to efficiently clean the wire by preventing powdery dust from adhering thereto again.

A cleaning tool for cleaning an optical connector includes: a head that presses a cleaning unit against the optical connector; a supply reel that supplies the cleaning unit to the head; and a take-up reel that collects the cleaning unit from the head. The supply reel and the take-up reel are disposed rotatably about a common rotation shaft.

The disclosure is directed at a method and apparatus for cleaning a surface having multiple protruding studs. The apparatus includes a top plate portion and a bottom plate portion along with a drive assembly which assists in moving the bottom plate portion with respect to the top plate portion. The drive assembly also translates rotational forces applied by a rotary tool to linear forces which are then applied to the bottom plate portion to clean the surface.

A cleaning tool includes: a first tape including an adhesive surface; a head around which the first tape is wrapped and that presses the adhesive surface against an object; a feeder that transports the first tape and a second tape in contact with the adhesive surface; and a separator that separates the first tape from the second tape during transportation of the first tape to the head.

Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber

A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.

A cleaning implement includes a foam having a density from 8 to 36 kg/m.sup.3. The cleaning implement has a thickness, a width, and a depth. The thickness is at least 22 mm, the width is less than or substantially equal to the depth, and the width is greater than the thickness. Methods for cleaning hard surfaces with a cleaning implement include bringing the cleaning implement into contact with a hard surface.

Methods and apparatus for cleaning a central venous catheter port are disclosed. An apparatus includes a body, a coupling configured to connect the body to the hub, a cleaning cap coupled to the body, and an actuator disposed within the body for rotating and translating the cap relative to the hub. The cleaning cap includes a cap body defining a cavity and a cleaning member disposed within the cavity, the cleaning member having threads that engage with the threads on the hub.

A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

An optical connector cleaning tool includes a fitting portion (44) fitted in the first or second hole (36, 37) of a connection component (32) into which a compact dual core optical connector is fitted on one end side and a cleaning medium (45) projecting from the fitting portion (44). The fitting portion (44) is formed to have a shape by which the fitting portion (44) is fitted in the first or second hole (36, 37) in each of the first and second postures as postures shifted through 180 with respect to as the center the middle (P2) of a virtual straight line connecting the centers of the two ferrules when viewed from an axial direction of the compact dual core optical connector. The fitting portion (44) contacts one ferrule in a state in which the fitting portion (44) is set in the first posture. The fitting portion (44) contacts the other ferrule in a state in which the fitting portion (44) is set in the second posture. There can be provided an optical connector cleaning tool by which the connection end faces of the compact dual core optical connector having two ferrules in one housing can be cleaned.