A rinsing device for boosting the quality of the rinsing of a cleaning device to facilitate and improve the cleanness of surface cleaning, the rinsing device comprising a first tank (41) provided to collect wastewater coming from the cleaning device, a second tank (42) provided to store clean water, and a mechanical pumping device (15, 50) configured to pump clean water coming from the second tank (42) to wet the cleaning device.

A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.

Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on movable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and movable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.

A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.

A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.

A substrate cleaning apparatus for cleaning a substrate while rotating the substrate and placing a cleaning member in contact with the rotating substrate is disclosed. The substrate cleaning apparatus comprises: a self-cleaning member mounted to an arm supporting the cleaning member, the self-cleaning member being configured to come into contact with the cleaning member to perform self-cleaning of the cleaning member; and a moving mechanism mounted to the arm supporting the cleaning member, the moving mechanism being configured to move the self-cleaning member between a position where the self-cleaning member is in contact with the cleaning member and a position where the self-cleaning member is separated from the cleaning member.

An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.

A substrate cleaning apparatus includes a substrate holding unit, a brush, an arm, a discharge portion and a guide member. The substrate holding unit is configured to hold a substrate rotatably. The brush has a main body, a cleaning body provided at a lower portion of the main body and configured to be pressed onto the substrate, and a hollow portion formed in the main body and provided with an open top and an open bottom. The arm is configured to rotatably support the main body with a spindle therebetween. The discharge portion is provided at the arm, and plural kinds of processing liquids are discharged from the discharge portion while being switched. The guide member is provided between the discharge portion and the brush, and is configured to receive the processing liquid discharged from the discharge portion and guide the received processing liquid into the hollow portion.

Exemplary embodiments of cleaning buckets are shown and described herein. An exemplary cleaning bucket includes a housing that has a cleaning solution reservoir, a dirty water reservoir and an insert for inserting into the housing. The housing has a first surface. The first surface covers the cleaning solution reservoir. The first surface is configured to allow water to flow into the dirty water reservoir through one or more openings allowing fluid to flow into the dirty water reservoir. The insert further includes a cleaning solution dispensing member located on the first surface, a pump for drawing cleaning solution out of the cleaning solution reservoir; and an activation device for causing the pump to pump fluid from the cleaning solution reservoir to the cleaning solution dispensing member.

A method and apparatus for a separable assembly in a platen assembly is provided. The two components of the separable assembly couple together through the first coupling member and the second coupling member, and the coupling is magnetic. The web assembly and hub assembly are placed or decoupled via the methods as described above. The separable components of the assembly reduce the cost and time of removing the entire platen assembly from the CMP system when maintenance or repair is to be performed.