According to one embodiment, a cleaner head includes a first rotor, a second rotor, and a contact surface. The first rotor can be rotationally driven in a state where an outer peripheral surface of the first rotor is in contact with a sheet that includes organic fiber and is formed on a base, and can remove a part of the sheet from the base. The second rotor is arranged next to the first rotor in a direction along a rotation axis of the first rotor, and is rotated together with the first rotor in a state where the second rotor is not in contact with the sheet. The contact surface is in contact with an outer peripheral surface of the second rotor at a position away from the sheet around the rotation axis.

A method of cleaning wafer-cleaning brushes includes passing a wafer having a first polished main side and an opposing unpolished backside between a pair of substantially cylindrical shaped wafer-cleaning brushes are rotated about an axial direction of the brushes while passing the wafer between the pair of wafer-cleaning brushes. A cleaning solution is applied to the brushes while passing the wafer between the pair of wafer-cleaning brushes. While passing between the pair of brushes, the first polished main side of the wafer faces a first direction, the first direction is an opposite direction to which a polished side of a production wafer faces during a subsequent polished wafer cleaning operation. The substantially cylindrical shaped wafer-cleaning brushes include a plurality of protrusions on an external surface of the brushes, and the brushes contact the wafer at least a portion of time the wafer is passing between the pair of brushes.

A substrate cleaning apparatus for cleaning a substrate while rotating the substrate and placing a cleaning member in contact with the rotating substrate is disclosed. The substrate cleaning apparatus comprises: a self-cleaning member mounted to an arm supporting the cleaning member, the self-cleaning member being configured to come into contact with the cleaning member to perform self-cleaning of the cleaning member; and a moving mechanism mounted to the arm supporting the cleaning member, the moving mechanism being configured to move the self-cleaning member between a position where the self-cleaning member is in contact with the cleaning member and a position where the self-cleaning member is separated from the cleaning member.

A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

A cleaning device includes: a cleaning unit that cleans a cleaning section by coming into contact with the cleaning section, the cleaning section being disposed in a transport space through which a medium is transported; a support unit that supports the cleaning unit, the support unit rotating about a rotation center to cause the cleaning unit to pass the cleaning section in a direction along a transporting direction in which the medium is transported; and a removing unit that is disposed upstream of the cleaning section in the transporting direction of the medium and that comes into contact with the cleaning unit to remove a substance adhering to the cleaning unit.

A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.

Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

An automatic removal system for automatically removing a tape and a resin exposed to the outside of a battery module includes a removal assembly including a removal device for removing the tape and the resin, and an automatic multi-axis robot coupled to the removal assembly and configured to drive to remove the tape and the resin of the battery module.

An apparatus for cleaning earphones that includes a brush element, a positioning element, and a motive element. A brush element selectively contacts and removes debris from an earphone, and a positioning element supports the earphone in a desired position relative to the brush element. A motive element is configured to move the brush element relative to the earphone. A corresponding system and method are also disclosed and claimed herein.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.