A system and method for cleaning mesa sidewalls of a template. Curable material may be deposited in a cleaning drop pattern onto a non-yielding imprint field of one of: a device yielding substrate; and a non-yielding substrate. The template may be brought into contact with the curable material. The template has: a recessed surface; a mesa extending from the recessed surface; and wherein the mesa sidewalls connect the recessed surface to the mesa. A relative position of the template to the cleaning drop pattern may be such that the curable material spreads up the mesa sidewalls and does not contact the recessed surface. Cured material may be formed by exposing the curable material to actinic radiation after the curable material has spread up the mesa sidewalls, and before the curable material contacts the recessed surface. The template may be separated from the cured material.

To dry a substrate formed with a pattern on a front surface satisfactorily and with excellent drying performance, a substrate processing method comprises: a liquid film formation step of forming a liquid film of a processing liquid, in which cyclohexanone oxime is dissolved in a solvent, on a front surface of a substrate formed with a pattern by supplying the processing liquid to the front surface of the substrate; a solidified film formation step of forming a solidified film of the cyclohexanone oxime by solidifying the liquid film of the processing liquid; and a sublimation step of removing the solidified film from the front surface of the substrate by sublimating the solidified film.

A substrate processing apparatus for processing a substrate to manufacture a semiconductor device, includes: a mounting table on which a substrate is mounted; a first liquid supply part that supplies a first liquid to form a polymer film having a urea bond on the substrate mounted on the mounting table; a second liquid supply part that supplies a second liquid reacting with the first liquid; and a nozzle part provided at an end portion of a liquid flow path where the first liquid supplied from the first liquid supply part and the second liquid supplied from the second liquid supply part are joined with each other to obtain a mixed solution, and configured to supply the mixed solution to the substrate to form the polymer film on a surface of the substrate, wherein the polymer film is temporarily used for manufacturing the semiconductor device and is subsequently removed by depolymerization.

A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.

An adhesive dust removal device includes a base member having a planar base surface, and an adhesive device attached to the base surface of the base member, the adhesive device includes an adhesive paper attached to the base surface of the base member, a release layer attached to the adhesive paper, and the other adhesive papers are attached to the release layer for sticking and removing the dust and the contaminant. It is preferable that the base member includes a parallelepiped structure having the planar base surface, and the adhesive device includes a rectangular structure for attaching to the planar base surface of the base member.

An absorbent is provided, which is produced from component A, a foaming agent, and component B, a resin. Furthermore, a device and a method for producing the absorbent and a method for absorbing a liquid by means of the absorbent are provided.

A squid-type marine oil containment device includes a track and four oil containment booms. A robotic arm is provided in an elliptic area formed by the track. Sliders are provided on the track. Ends of oil containment booms slide along the track through sliders. Each oil containment boom includes an oil suction pipe, propellers and a plastic separating layer. A middle of the oil suction pipe forms an oil channel. Booster pumps are spacedly provided inside the oil suction pipe and are respectively connected to a hose. Pairs of propellers are spacedly provided at a lower end of the oil suction pipe. Oil suction holes are provided on the oil suction pipe. The plastic separating layer is provided under the oil suction holes. A counterweight is provided at a bottom of the oil containment boom. The invention further provides a method of containing oil using the device.

A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.

According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.

A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.