A system and method for cleaning, protecting and lubricating hyperbolic rollers and bearings for bending, using air and oil, placed in a rotating rotor (1) that contains rollers (32) placed on bearings (34) and shafts (33) inside roller housings (30), where rollers (32) are positioned at an angle with respect to the bending axis and, as bending occurs they cause bending and also as rotor (1) rotates around the item being bent it straightens and feeds the item. Rollers (32) are placed on bearings (34) and are protected through rotational seals (35). The bearings' (34) area of rollers (32) inside the rotational seal (35) is supplied with air at pressure higher than the atmospheric, so that inflow of contaminants are inhibited, or is supplied with air enriched with oil so that bearings (34) are lubricated, and rotational seals (35) located next to bearings (34) of the rollers (32) allow the air flow from the area between the bearings towards the surrounding area.

A method for evaluating a silicon wafer, including: a pre surface defect measuring step for performing a surface defect measurement on the silicon wafer in advance, a cleaning step of alternately repeating on the silicon wafer an oxidation treatment by ozone water and an oxide film removal treatment by hydrofluoric acid under a condition of not completely removing an oxide film formed on a surface of the silicon wafer, and an incremental defect measuring step of performing a surface defect measurement on the silicon wafer after the cleaning step and measuring incremental defects that increased relative to defects measured in the pre surface defect measuring step, wherein the cleaning step and the incremental defect measuring step are alternately performed repeatedly multiple times and the silicon wafer is evaluated based on a measurement result of the incremental defects after each cleaning step.

Automatic probe card cleaning apparatus includes a vacuum pump connected to draw air through an exhaust nozzle, an ionizer with connected to direct a stream of ionized air through an output nozzle, and a support structure that supports the nozzles proximate a probe needle of a probe card, the support structure movable between a first cleaning position and a second position that allows the probe needle to contact a wafer for testing.

A method for cleaning a silicon wafer includes the steps of: supplying hydrofluoric acid onto a surface of the silicon wafer to treat the silicon wafer while rotating at a first rotational rate, stopping the supply of the hydrofluoric acid and shaking off hydrofluoric acid on the surface of the silicon wafer without supplying pure water onto the surface of the silicon wafer while rotating the silicon wafer at a second rotational rate which is the same as or faster than the first rotational rate, and supplying ozone water onto the surface of the silicon wafer to treat the silicon wafer after shaking the hydrofluoric acid off the surface while rotating at a third rotational rate which is faster than the second rotational rate. This method for cleaning a silicon wafer is capable of suppressing adhesion of water marks and particles and enhancing the wafer quality.

The present invention relates to a laundry-care appliance (100) having a washing tub (107) and a deodorizing module (109) for dispensing deodorizing substance into the washing tub (107), wherein the deodorizing module (109) is connected to the washing tub (107) and comprises a radial fan (115) for ventilating the washing tub (107), wherein the radial fan (115) is drivable in a first direction of rotation (121) and in a second direction of rotation (123). The deodorizing module (109) is configured to dispense deodorizing substance into the washing tub (107) in a first period of time, wherein the radial fan (115) is drivable in the first direction of rotation (121) in the first period of time in order to distribute the deodorizing substance in the washing tub (107). The radial fen (115) is drivable in the second direction of rotation (123) in a second period of time following the first period of time, in order to remove the deodorizing substance from the washing tub (107) in the second period of time.

Plant for washing and sanitising the udders of dairy animals of the type consisting of a control panel (1), for the management and the control of the entire plant, a tank (2) for water collection and delivery, a motor body (3) for plant management and a brush body (4) for animal treatment, characterised in that ozone generator (5), structure for ozone enrichment of the water delivered by said tank (2) and structure for drying the udders with ozone once the washing has been completed and furthermore provided.

A method for cleaning a silicon wafer includes the steps of: supplying hydrofluoric acid onto a surface of the silicon wafer to treat the silicon wafer while rotating at a first rotational rate, stopping the supply of the hydrofluoric acid and shaking off hydrofluoric acid on the surface of the silicon wafer without supplying pure water onto the surface of the silicon wafer while rotating the silicon wafer at a second rotational rate which is the same as or faster than the first rotational rate, and supplying ozone water onto the surface of the silicon wafer to treat the silicon wafer after shaking the hydrofluoric acid off the surface while rotating at a third rotational rate which is faster than the second rotational rate. This method for cleaning a silicon wafer is capable of suppressing adhesion of water marks and particles and enhancing the wafer quality.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a cleaning unit configured to clean a bottom surface of the substrate supported on the support unit, and wherein the cleaning unit comprises: a body; and a protrusion formed to be upwardly protruding from the body, and the protrusion is positioned to be spaced apart from the bottom surface.

A washing appliance for application in pharmaceutical production and/or preclinical pharmaceutical research centres, and for the execution of washing/rinsing steps on parts and components for pharmaceutical production, comprising a hydraulic circuit for the circulation of washing/rinsing liquid and a recirculation pump in the hydraulic circuit, comprising: a wash chamber adapted to contain said parts and components for pharmaceutical production to be washed, said chamber comprising one or two hermetically closed access doors; one or more washing systems, internal to the wash chamber and connected to said hydraulic circuit, and adapted to supply wash liquid into the chamber; an accumulation basin at the bottom of the wash chamber, for accumulating the washing/rinsing liquid, connected to said recirculation pump; a heat exchanger for heating or maintaining the temperature of the washing/rinsing liquid received through said recirculation pump and supplied to said one or more washing systems; a generator of gaseous ozone; a mixer adapted to mix said gaseous ozone with the washing/rinsing liquid and arranged in said hydraulic circuit; a control system adapted to control said washing/rinsing steps of the appliance, and adapted to control said gaseous ozone generation system for mixing said gaseous ozone during any one of said washing/rinsing steps of the appliance.

An apparatus and a method for processing one or more surfaces of a semiconductor wafer with one or more ozone-containing fluids are provided. The apparatus includes an ozone generator, a solvent flask, a gas-liquid mixing device, and a processing chamber capable of receiving the semiconductor wafer. The apparatus may also include one or more gas-liquid separation devices and switching valves. The processing chamber allows the ozone-containing fluids to enter the processing chamber for treating the wafer surface. The effectiveness of the treatment is ensured by enhancing the ozone concentration of the ozone-containing fluids inside the processing chamber, in either or both gas and liquid phases. The employment of a micro chamber as the processing chamber also helps to reduce the consumption of the treatment gas and liquid, as well as the resulted waste emission.