A resistance soldering system includes a power input receiving an alternating current from a power source and a controller circuit generating a control signal indicative of a desired power level delivered for a desired time. The resistance soldering system further includes a silicon-controlled rectifier connected to the power input and the controller circuit and producing a control voltage proportional to the control signal and a transformer having a primary side receiving the control voltage and a secondary side having output leads configured to apply an output voltage to a solder joint disposed between the output leads. The controller circuit determines the control signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time. The controller circuit controls the desired power level independent of the desired time. A method of operating a resistance soldering system is also presented.

The present invention relates to inserts for hard facing substrates, and a method for hard facing substrates. An insert according to an embodiment of the present invention may comprise a body of ultra-hard material having a welding node located on a first surface thereof and at least one wire electrically connecting the first surface to a second, opposite, surface. In use, the inserts may be temporarily connected to a substrate by applying a resistance welding electrode to the welding node, thereby causing the wires on the second surface to melt and weld the insert to the substrate. A subsequent brazing step may firmly attach the inserts to the substrate.

A power delivery system includes a power-input-channel, an AC/DC converter, one or more controller-circuits, a silicon-controlled-rectifier, a transformer, and a pair of output-leads. The power-input-channel receives alternating-current from a power-source. The AC/DC converter converts the alternating-current to a direct-current at a converter-output. The one or more controller-circuits are connected with the converter-output and control a signal indicative of a desired-power-level delivered for a desired-time. The silicon-controlled-rectifier is connected with the power-input-channel and controls an SCR-output-voltage to an SCR-output-channel proportional to the signal. The transformer reduces the SCR-output-voltage from a primary-side to a secondary-voltage on a secondary-side. The pair of output-leads are connected with poles of the secondary-side. A solder-joint is disposed between the pair of output-leads. The one or more controller-circuits determine the signal applied to the silicon-controlled-rectifier required to melt the solder-joint based on the desired-power-level and the desired-time, thereby melting the solder-joint disposed between the pair of output-leads.

A method for bonding electrical conductors is provided that is capable of suppressing a power source capacity when assembling a stator having a specific structure. First, coil pieces 9 are arranged in contact with bonding portions of a slot coil 5 inserted in a slot of a stator iron core 2 via a metal paste. Subsequently, an electrical current is applied using a pair of electrodes 11A and 11B in the axial direction (upward and downward in the figures) of the slot coil 5 while contact portions 15 between the slot coil 5 and the coil pieces 9 are pressed in an axial direction of the slot coil 5. As a result, electricity flows in the axial direction the coil piece 9 (a direction of an arrow X in the figures).

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.

A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

The present disclosure describes a resistance soldering method for producing a plate assembly including at least two basic elements that are materially bonded together via a soldering device, e.g., for producing a winding of an electrical machine. The method includes applying an output voltage to a first electrode and a second electrode, between which the at least two basic elements are arranged, to solder a solder element interposed therebetween; detecting a correct or incorrect position of the solder element in the plate assembly via a control unit; determining via the control unit a voltage between the solder element and one or more points on the electric circuit. The control unit detects the correct or incorrect position of the solder element through an evaluation and/or a comparison with reference to the voltage or voltages.

The invention relates to an anodic bonding method for bonding two elements with an intermediate layer. The invention especially, but not exclusively, relates to an anodic bonding method for between a metallic element and a heterogeneous element, for example a glass, artificial sapphire or ceramic element. The specificity and aim of the present invention is to produce an assembly that is gas-tight and fluid-tight, solderless, brazing- or welder-free and without organic compound (glue). The present method has multiple industrial applications, including making it possible to attach a watch-glass, typically made of mineral glass, sapphire or transparent or translucent ceramics, to a bezel or case middle of a watch case using the anodic bonding technique.

A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.

A method for creating metallic sandwich structures that includes providing at least two face sheets; providing at least two core sheets; orienting the core sheets relative to one another in a predetermined manner; and using indirect resistance roll brazing to join the core sheets to the face sheets to create a sandwich structure.