A glass plate module according to the present invention includes a glass plate, an electrically conductive layer laminated on the glass plate, at least one connection terminal fixed to the electrically conductive layer and made of an electrically conductive material, and lead-free solder for fixing the connection terminal to the electrically conductive layer. The connection terminal includes an installation portion that is fixed to the electrically conductive layer via the lead-free solder, a standing portion that extends from an end portion of the installation portion in a direction away from the glass plate, and a connection portion that is coupled to an end portion of the standing portion on the opposite side to the installation portion and extends in a direction away from the installation portion along a surface direction of the glass plate.

Provided is a heater which includes a base film having a metal foil on a surface of the base film, and a resistor. The metal foil forms a heater circuit that generates heat when energized, and the heater circuit is connected in series with the resistor.

An IC chip package includes a substrate having a plurality of interconnect metal pads, and a chip having a plurality of interconnect metal pads arranged thereon. An interconnect solder structure electrically connects each of the plurality of interconnect metal pads. The chip is devoid of the interconnect solder structures and interconnect metal pads at one or more corners of the chip. Rather, a dummy solder structure connects the IC chip to the substrate at each of the one or more corners of the IC chip, and the dummy solder structure is directly under at least one side of the IC chip at the one or more corners of the IC chip. The dummy solder structure has a larger volume than a volume of each of the plurality of interconnect solder structures. The dummy solder structure eliminates a chip-underfill interface at corner(s) of the chip where delamination would occur.

A system for automatically brazing joints in a manifold has a loading station, a brazing station, and a cooling station. The brazing station has a plurality of brazing torches moveable to a joint in the manifold to braze the joint. First, second and third fixture frames extend from a common rotatable platform. The platform rotates each of the fixture frames to each of the loading station, brazing station, and cooling station in turn. The fixture frames support manifolds with joints requiring brazing. The torches are disposed on a lifting platform that lifts the torches up to a desired joint. The lifting platform is disposed on a sliding platform that slides the torches horizontally to the desired joint. The torches surround the joint and braze it from all sides simultaneously. While brazing is being performed at the brazing station, loading and unloading of manifolds may be done at the loading station, and cooling of already-brazed manifolds may take place at the cooling station.

A method for producing a component of a sliding bearing includes a) providing a metal bolt with a cylindrical lateral surface and two end faces; b) coating the lateral surface of the bolt with a soldering flux or solder material; c) providing a metal sheet made of bronze and forming it into a cylindrical sleeve having a longitudinal slot, wherein a first side of the metal sheet forming an inside is coated with a solder material or a soldering flux before or after the forming process, either the lateral surface of the bolt or the inside of the sleeve having soldering flux; d) sliding the sleeve onto the lateral surface of the bolt; e) integrally bonding the lateral surface and the sleeve soldering; f) optionally closing the longitudinal slot by welding; and g) optionally machining a second side of the metal sheet facing away from the bolt.

A cutting insert includes a substrate and a cutting-edge insert. The substrate has, in a thickness direction of the substrate, a bottom surface, and a top surface opposite to the bottom surface. The top surface has a polygonal shape composed of a plurality of sides in a plan view as seen along the thickness direction. The top surface is provided with a projection projecting to a side opposite to the bottom surface along the thickness direction. The projection has a through-hole passing through the substrate along the thickness direction. The projection has a side surface contiguous to the top surface. The side surface is composed of a curved line protruding to a side opposite to the through-hole in the plan view as seen along the thickness direction.

Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.

A manufacturing method is provided during which a plurality of first apertures are formed in a first plate to provide an apertured first plate. A plurality of second apertures are formed in a second plate to provide an apertured second plate. The apertured first plate and the apertured second plate are bonded to a base sheet to form a structure. The base sheet is bent to form a bend in the structure between the apertured first plate and the apertured second plate.

Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

A folding plate according to an embodiment of the present invention has first and second support portions located on both sides of a folding portion that is foldable, and is formed as a multilayer structure in which first and second metal sheets of different metal materials are braze-bonded, and thus, is thin and lightweight, has excellent flexibility, and easily dissipates heat.