An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.

Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket to form a covered PDC cutter pocket, the hardfacing layer comprising a metal binder and coated tungsten carbide particles; and bonding a PDC cutter into the covered PDC cutter pocket with a brazing material. Steel body PDC drilling tools may include a steel body, a PDC cutter, a PDC cutter pocket, and a hardfacing layer. Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket of the steel body PDC drilling tool; applying a coated buffering layer on the hardfacing layer to form a coated PDC cutter pocket; and bonding the PDC cutter into the coated PDC cutter pocket with a brazing material.

A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly’s PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.

A method and apparatus for mounting optical components is described. The apparatus is suitable for mounting multiple optical components and comprises a baseplate having opposing first and second surfaces. Recesses or apertures are formed within the baseplate and are located upon the first or second surfaces so as to define thermally activated optic mounting areas. Pillars are then located within the thermally activated optic mounting areas and these provide a means for attaching the optical component to the baseplate. The employment of the recesses or apertures act to significantly reduce the thermal conduction throughout the baseplate. As a result preferential heating can be provided to the one or more thermally activated optic mounting areas while maintaining the baseplate with a desired mechanical strength. The optical mounting apparatus exhibits a high thermal stability thus making the apparatus ideally suited for use within commercial optical system.

Systems and methods for the batch production of large numbers of highly uniform multichannel-plate photomultiplier tubes (MCP-PMTs) for large-scale applications are provided. The systems and methods employ dual, nested low-vacuum (LV) and UHV processing in a rapid-cycling, small-footprint, scalable, batch-production facility that is capable of fabricating many MCP-PMTs simultaneously.

A closed impeller (1) includes an impeller main body (2), which is composed of an aluminum alloy and has blades (22) that protrude from a hub (21). A shroud (3) covers the blades. The blades and the shroud are joined together by brazed joints (4). The shroud (3) is formed from a brazing sheet (30) that comprises a core material (31), which is composed of an aluminum alloy, and a filler material layer (320), which is disposed on an outermost surface (33) of the shroud that opposes or faces the blades when the shroud is brazed to the blades.

The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.

A vacuum insulated glass product and the method for making the same, wherein the vacuum insulated glass comprises: a first glass substrate; a second glass substrate disposed facing the first glass substrate; a sealing structure provided between the first glass substrate and the second glass substrate and used for airtight binding of the first glass substrate and the second glass substrate to form a vacuum cavity; and a plurality of supports provided inside the vacuum cavity for bearing pressure from the first glass substrate and the second glass substrate. The sealing structure comprises: metal layers which are fixedly formed on facing surfaces of the first glass substrate and the second glass substrate, and an intermediate solder layer which is disposed between and connects the metal layers. The sealing structure has arc-shaped transition structures at the corner areas of the glass substrates.

Method of manufacturing a metal-ceramic substrate (1) which, in the finished state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer (12) and the ceramic layer (11) and bonding the metal layer (12) to the ceramic layer (11) in regions to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).

In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).