A vehicle body structure includes a roof structure and a lateral side structure, wherein the roof structure includes a roof panel fastened to an underlying roof reinforcement frame, wherein the lateral side structure includes a side panel fastened to an underlying side support structure, wherein a lateral side of the roof panel is fastened to the roof reinforcement frame by means of a hemming joint that is formed by folding a lateral side of the roof panel around an edge of the roof reinforcement frame, and wherein a folded side edge of the roof panel is fastened to the side panel by means of an elongated laser brazing joint.

The present application describes a method for attaching a first part (20) and a second part (30) for mechanical assembly to each other, the method comprising spraying a powder (10) of a ductile material onto the parts (20, 30), causing the parts (20, 30) to become attached to one another by agglomeration of this powder (10), the method comprising texturing at least one surface of one of the two parts (20, 30) onto which the spraying is subsequently carried out.

An electronic device includes a plurality of micro-optoelectronic components and a circuit board. Each of micro-optoelectronic components includes a semiconductor layer, and metal electrodes electrically coupled to the semiconductor layer and exposed on a surface of the semiconductor layer. The circuit board includes a metal circuit layer and a plurality of solder joints. The solder joints are formed on said metal circuit layer, and connected to said metal electrodes. A portion of each of metal electrodes and each of solder joints are welded to form a metal crystalline structure. The metal crystalline structure includes the composition of the metal electrode and/or the composition of the metal circuit layer.

The present disclosure is directed to a compact vertical oven for reflow of solder bumps for backend processes in semiconductor wafer assembly and packaging. This disclosure describes a vertical oven which uses a plurality of wafers (e.g., an example value is 50-100 wafers) in a batch with controlled injection of the reducing agent (e.g. formic acid), resulting in a process largely free of contamination. This disclosure describes controlled formic acid flow through a vertical system using laminar flow technology in a sub-atmospheric pressure environment, which is not currently available in the industry. The efficacy of the process depends on effective formic acid vapor delivery, integrated temperature control during heating and cooling, and careful design of the vapor flow path with exhaust. Zone-dependent reaction dynamics managed by vapor delivery process, two-steps temperature ramp control, and controlled cooling process and formic acid content ensures the effective reaction without any flux.

A method for selectively adhering braze powders to a surface comprises applying a binder material to a surface, depositing a braze powder on the binder material, and then directing a laser beam onto the braze powder while the laser beam moves along a predetermined path relative to the surface. The laser beam selectively heats the braze powder and the binder material along the predetermined path such that the binder material is removed and the braze powder is sintered and bonded to the surface. Thus, a braze deposit is formed at one or more predetermined locations on the surface. After forming the braze deposit, excess braze powder and binder material, that is, the braze powder and binder material not selectively heated by the laser, are removed from the surface.

In various examples, an apparatus includes a first hypotube formed from a first material and a second hypotube formed from a second material different from the first material. A first joint is formed between the first hypotube and the second hypotube, the first joint including a combination of the first material and the second material. The apparatus includes a sidewall and a passageway extending through the apparatus. The sidewall is formed by the first sidewall of the first hypotube, the second sidewall of the second hypotube, and the first joint. The apparatus includes an outer diameter that is substantially consistent along a length of the apparatus and an inner diameter that is substantially consistent along a length of the apparatus. In other examples, a method of joining the first hypotube to the second hypotube is contemplated.

A gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet of the gas nozzle having a gas distributor/diffuser section has a double-walled configuration at least in a partial area of the gas distributor/diffuser section in order to create a flow space for the protective/shielding gas stream. The invention also relates to a torch neck and to a method for thermally joining at least one workpiece, in particular for arc joining, preferably for arc welding or arc brazing/soldering, with an electrode which is arranged in the torch neck or with a wire for producing an arc between the electrode or the wire and the workpiece, and having a gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet.

A gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet of the gas nozzle having a gas distributor/diffuser section has a double-walled configuration at least in a partial area of the gas distributor/diffuser section in order to create a flow space for the protective/shielding gas stream. The invention also relates to a torch neck and to a method for thermally joining at least one workpiece, in particular for arc joining, preferably for arc welding or arc brazing/soldering, with an electrode which is arranged in the torch neck or with a wire for producing an arc between the electrode or the wire and the workpiece, and having a gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet.

Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.

An amalgamation preform is provided. The amalgamation preform includes a base metal, and a plurality of types of solid particles dispersed in the base metal, the base metal including one of a liquid base metal and a solid base metal. The plurality of types of solid particles at least includes: non-reactive magnetic particles, responsive to a magnetic field for controllably dispersing the plurality of types of solid particles in the base metal, and reactive particles, reactable with the base metal under the magnetic field.