The disclosure discloses a manufacturing method of tempered vacuum glass. At least one glass substrate constituting the tempered vacuum glass is reserved with an extraction opening, and the manufacturing method comprises the following steps: (1) manufacturing metalized layers, and performing tempering or thermal enhancement on the glass substrates; (2) placing a metal solder on the metalized layers; (3) superposing the glass substrates; (4) heating the overall glass substrates to 60-150° C.; (5) hermetically sealing the glass substrates under the condition of ensuring the heating temperature; (6) heating; (7) vacuumizing; and (8) closing the extraction opening, thus accomplishing the manufacturing process. The manufacturing method in the present disclosure can greatly reduce the stress when the two glass substrates are sealed, improve the soldering strength and prolong the service life of the tempered vacuum glass. The disclosure further discloses a tempered vacuum glass production line based on the above manufacturing method.

A cored filler wire (10) used in a laser metal deposition (LMD) process and method of using the same. The cored filler wire includes an outer shell (12) surrounding an inner filler material (14). The outer shell is formed from a first material, e.g., a nickel based alloy having a low gamma prime content. The inner filler comprises at least a second material, e.g., a nickel based superalloy powder material comprising a gamma prime content higher than the first material. Upon laser processing, via LMD, and subsequent solidification, the resulting build-up layer (18) formed from the processed cored filler wire comprises an identical or near identical chemical composition to that of the underlying base material (5) or component being repaired.

A laser soldering device for laser soldering an electric circuit of a heating portion of an electronic cigarette, the soldering device including a head having an emitting area where a laser beam is emitted and a feeding device to feed a heating portion of an electronic cigarette along a feed path, where the heating portion faces the head at the emitting area. A movement device is operatively connected to the head to move the head between first and second points of the electric circuit such that the laser beam is perpendicular to the respective surface to be soldered at the first and second points to form first and second connections, respectively. The head generates two distinct pulses of the laser beam at the first and second points.

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

An imaging device that includes at least one lens that collects light incident from an object; an imaging sensor that receives light from the lens and converts it to an electric signal; a multi-layer substrate electrically connected to the imaging sensor that includes electronic components and conductive layers and vias; and a collective cable including at least one coaxial cable. A core connection electrode connected to a core of the coaxial cable is formed on a first surface of the multi-layer substrate, the first substrate intersecting with a height direction of the multi-layer substrate. A shielded-wire connection electrode connected to a shielded wire of the coaxial cable is formed on a side surface of the multi-layer substrate adjacent to the first surface. The side surface faces and the cable extend to a proximal end.

A method of joining and sealing a vanadium based membrane to a metallic connection section comprising: mounting a section of a vanadium based membrane on a connector formation of a connection section, the connection section being formed of a different metal to the vanadium based membrane, the connector formation providing a recess into which a section of the vanadium based membrane is seated and a connection interface in which the end face of the vanadium based membrane is proximate to or substantially abuts an adjoining face of the connector formation; mounting and operating a chiller arrangement in thermal contact with vanadium based membrane proximate the connection interface; heating a filler metal on the connection section to at least the liquidus temperature of the filler metal using a laser beam directed onto the filler metal located on the connection section and having a beam edge positioned at an offset location spaced apart from the connection interface a distance that attenuates direct heating of the vanadium based membrane by the laser beam, and on the connection section, such that the filler metal can flow over the connection interface from the offset location onto the vanadium based membrane; and cooling the filler metal to form a bridging section of filler metal between the vanadium based membrane and connection section over the connection interface.

Presented are intelligent non-autogenous metalworking systems and control logic for automated wire-to-beam alignment, methods for making/using such systems, and robot-borne laser welding/brazing heads with closed-loop control for real-time wire alignment. A method for controlling operation of a non-autogenous workpiece processing system includes a system controller receiving sensor signals from a position sensor indicative of a location of filler wire discharged into a joint region by a wire feeder. Using the received sensor signals, the controller determines a displacement between the wire location and a location of a beam emitted onto the joint region by a beam emitter. If the wire displacement is greater than a threshold wire displacement value, the controller responsively determines a corrective force calculated to reduce wire displacement to below the threshold wire displacement value. The controller then commands the actuator to pivot the processing head to thereby apply the corrective force to the discharging filler wire.

A chip carrying structure having chip-suction function is provided. The chip carrying structure includes a non-circuit substrate and a plurality of micro heaters. The non-circuit substrate has a plurality of openings and a plurality of air extraction channels respectively communicated with the openings. The micro heaters are disposed on the non-circuit substrate and carried by the non-circuit substrate. Each of the openings of the non-circuit substrate contacts and suctions one of a plurality of chips, and no adhesive layer is disposed between the non-circuit substrate and the chip. When air is exhausted from the air extraction channels, the openings of the non-circuit substrate can be used to respectively suck the chips, so that the chips can be attached to the non-circuit substrate, and the micro heater can heat a solder ball that is contacted by the chip.

In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.

A method for butt laser welding two metal sheets (2, 4) includes providing a first metal sheet (2) and a second metal sheet (4) and butt welding the metal sheets (2, 4) along a direction of welding. The butt welding step includes simultaneously emitting a first front laser beam (12) creating a first front spot (18) at the intersection with the first metal sheet (2), and generating a first front keyhole (19) in the first metal sheet (2) at the first front spot (18); a second front laser beam (14) creating a second front spot (20) at the intersection with the second metal sheet, and generating a second front keyhole in the second metal sheet (4) at the second front spot (20); and a back laser beam (16) creating a back spot (22) on the first and second metal sheets (2, 4), and generating a back keyhole (23A) in the first and second metal sheets (2, 4) at the back spot (22). The first and second front laser beams (12, 14) and the back laser beam (16) are configured in such a manner that at each moment in time, a solid phase region (25) and/or a liquid phase region (13, 23B) of the metal sheets (2, 4) remains between the first front keyhole (19) and the back keyhole (23A) and between the second front keyhole and the back keyhole (23A).