A method is provided for joining at least two components of a medical instrument, the at least two components are held so as to form at least one soldering gap between mutually assigned joining areas of the components, a solder material is arranged for filling the at least one soldering gap, and the arrangement of the at least two components and of the solder material is heated to a soldering temperature of the solder material, wherein the solder material is an iron-based solder. A use of an iron-based solder and a medical instrument, in particular a laryngoscope spatula, are also provided.

A method is provided for joining at least two components of a medical instrument, the at least two components are held so as to form at least one soldering gap between mutually assigned joining areas of the components, a solder material is arranged for filling the at least one soldering gap, and the arrangement of the at least two components and of the solder material is heated to a soldering temperature of the solder material, wherein the solder material is an iron-based solder. A use of an iron-based solder and a medical instrument, in particular a laryngoscope spatula, are also provided.

A pre-flux coating for the manufacturing of heat exchanger components of aluminum, wherein the coating comprises a combination of fluxes in the form of potassium aluminum fluoride K.sub.1-3AlF.sub.4-6, potassium trifluoro zincate, KZnF.sub.3, lithium aluminum fluoride Li.sub.3AlF.sub.6, a filler material in the form of metallic Si particles, Al—Si particles and/or potassium fluoro silicate K.sub.2SiF.sub.6, an additive in the form of aluminum oxide and at least one other oxide selected from the group consisting of zinc oxide, titanium oxide and cerium oxide forming a post braze ceramic layer, and a solvent and a binder containing at least 10% by weight of a synthetic resin which is based, as its main constituent, on a methacrylate homopolymer or a methacrylate copolymer.

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

The invention relates to a method for producing a mistuning component. The method comprises the following steps: a) producing a container (34) having at least one chamber (36); b) producing a lid (32, 32′); c) inserting at least one impulse element into the chamber (36); d) joining the lid (32, 32′) and the container (36), wherein joining is carried out by soldering/brazing.

A hollow aluminum structure that will be brazed includes at least one brazing sheet having a filler metal layer clad onto a core layer. The core layer is composed of aluminum or an aluminum alloy containing less than 0.2 mass % Mg. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass % and Bi: 0.01-0.3 mass %, and further contains Li: 0.004-0.08 mass % and/or Be: 0.006-0.12 mass %, the filler metal layer containing less than 0.1 mass % Mg. The hollow aluminum structure is assembled such that the filler metal layer is present at locations that will form both an interior-facing brazed joint and an exterior-facing brazed joint. Then, flux is applied onto the filler metal layer at the location that will form the exterior brazed joint, and the hollow aluminum structure heated in an inert gas atmosphere to form the interior brazed joint and the exterior brazed joint.

A hollow aluminum structure that will be brazed includes at least one brazing sheet having a filler metal layer clad onto a core layer. The core layer is composed of aluminum or an aluminum alloy containing less than 0.2 mass % Mg. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass % and Bi: 0.01-0.3 mass %, and further contains Li: 0.004-0.08 mass % and/or Be: 0.006-0.12 mass %, the filler metal layer containing less than 0.1 mass % Mg. The hollow aluminum structure is assembled such that the filler metal layer is present at locations that will form both an interior-facing brazed joint and an exterior-facing brazed joint. Then, flux is applied onto the filler metal layer at the location that will form the exterior brazed joint, and the hollow aluminum structure heated in an inert gas atmosphere to form the interior brazed joint and the exterior brazed joint.

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.