Stencil frames for tensioning stencils of an angular shape are provided. The stencil frame comprises corner elements (2), edge elements (1), fastening elements (13) and tensioning devices with a tensioning device being associated with each edge element (1). The corner elements (2) each have two, mutually perpendicular, guiding profiles (12) which joined at an intersection of their axes and the edge elements (1) each have a uniaxial reception profile (11). Each reception profile (11) is connectable to two guiding profiles (12) by loose fit. Each tensioning device has at least one elastic element (5) and connects between two neighbouring corner elements (2). A line of force exerted by each tensioning device is parallel to the axis of its corresponding reception profile (11).

A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

A micro-electronic micro-connection deep-cavity welding capillary, comprising a cylindrical capillary body, one end of the capillary body is a frustoconical welding end, a stepped unfilled corner on an end face of the welding end in the lengthwise direction, the remaining end face of the welding end is a welding end face, a spherical segment-shaped through groove in the welding end face, a columnar first wire threading hole facing the interior of the capillary body in the other end face of the capillary body in the lengthwise direction, a columnar second wire threading hole that is coaxial with the first wire threading hole in a first side surface, not adjacent to the welding end face, of the unfilled corner, and a transition hole that connects the first wire threading hole to the second wire threading hole and has an isosceles-trapezoid-like cross section inside the capillary body.

A solder-reinforced bonding system comprises a first substrate (110), a second substrate (120) at least partially in contact with a heating element (400), an adhesive (200) in contact with a first contact surface (115) of the first substrate (110) and a second contact surface (125) of the second substrate (120), and a plurality of solder balls (300) positioned in the adhesive (200) in contact with the first contact surface (115) in a location to receive thermal energy from the heating element (400). A method of producing a solder-reinforced adhesive bond between a first substrate (110) and second substrate (120), comprises (i) applying an adhesive composite (250) including an adhesive (200) and a plurality of solder balls (300) on a first contact surface (115) of the first substrate (110), (ii) connecting a second contact surface (125) of the second substrate (120) to a portion of the adhesive composite (250) opposite the first contact surface (115), and (iii) applying thermal energy from a heating element (400).

The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

A paste supply apparatus includes: a pot holder which holds a paste pot including an inner lid movable in a container; an ejecting member; an annular protruding portion protruding downward from a lower surface of the ejecting member; a suction power generating mechanism which generates suction power in an internal space surrounded by the annular protruding portion; and an ejecting member lifting unit which moves up and down the ejecting member, The ejecting member lifting unit causes the ejecting member to press down the inner lid of the paste pot held by the pot holder to eject the paste from the through hole, and thereafter lifts the ejecting member which holds the inner lid by the suction power generated within the internal space of the annular protruding portion by the suction power generating mechanism.

A paste supply apparatus includes: a pot holder which holds a paste pot including an inner lid movable in a container; an ejecting member; an annular protruding portion protruding downward from a lower surface of the ejecting member; a suction power generating mechanism which generates suction power in an internal space surrounded by the annular protruding portion; and an ejecting member lifting unit which moves up and down the ejecting member, The ejecting member lifting unit causes the ejecting member to press down the inner lid of the paste pot held by the pot holder to eject the paste from the through hole, and thereafter lifts the ejecting member which holds the inner lid by the suction power generated within the internal space of the annular protruding portion by the suction power generating mechanism.

A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.