B23K20/02

Welding light metal workpieces by reaction metallurgy

Aluminum alloy workpieces and/or magnesium alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Bonding method
09731377 · 2017-08-15 · ·

A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%.

Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding

A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).

COOKWARE WITH COPPER BONDED LAYER
20220265079 · 2022-08-25 ·

Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy.

Dual alloy turbine rotors and methods for manufacturing the same

Dual alloy turbine rotors and methods for manufacturing the same are provided. The dual alloy turbine rotor comprises an assembled blade ring and a hub bonded to the assembled blade ring. The assembled blade ring comprises a first alloy selected from the group consisting of a single crystal alloy, a directionally solidified alloy, or an equi-axed alloy. The hub comprises a second alloy. The method comprises positioning a hub within a blade ring to define an interface between the hub and the blade ring. The interface is a non-contacting interface or a contacting interface. The interface is enclosed by a pair of diaphragms. The interface is vacuum sealed. The blade ring is bonded to the hub after the vacuum sealing step.

METHODS AND PROCESS FLOWS FOR DIFFUSION BONDING AND FORMING METALLIC SHEETS
20170216958 · 2017-08-03 ·

Methods and process flows for diffusion bonding and forming metallic sheets are disclosed herein. The methods include stacking a first metallic sheet and a second metallic sheet to define a sheet stack. The methods further include creating a pneumatic seal between the first metallic sheet and the second metallic sheet to define a sealed sheet stack that defines a pneumatically isolated region. The methods also include increasing a surface area of the sealed sheet stack to define an expanded sheet stack. The methods further include compressing at least a portion of the expanded sheet stack to form a diffusion bond between a corresponding portion of the first metallic sheet and an opposed portion of the second metallic sheet thereby defining a diffusion bonded sheet stack.

METHODS AND PROCESS FLOWS FOR DIFFUSION BONDING AND FORMING METALLIC SHEETS
20170216958 · 2017-08-03 ·

Methods and process flows for diffusion bonding and forming metallic sheets are disclosed herein. The methods include stacking a first metallic sheet and a second metallic sheet to define a sheet stack. The methods further include creating a pneumatic seal between the first metallic sheet and the second metallic sheet to define a sealed sheet stack that defines a pneumatically isolated region. The methods also include increasing a surface area of the sealed sheet stack to define an expanded sheet stack. The methods further include compressing at least a portion of the expanded sheet stack to form a diffusion bond between a corresponding portion of the first metallic sheet and an opposed portion of the second metallic sheet thereby defining a diffusion bonded sheet stack.

Bonding head and a bonding apparatus having the same

A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.