B23K26/02

LASER MACHINING DEVICE AND LASER MACHINING METHOD
20170304937 · 2017-10-26 ·

A unit vector calculating unit of a laser machining device obtains a unit vector based on respective current rotational positions of an A-axis and a B-axis. A movement command calculating unit, a speed command calculating unit, or a torque command calculating unit generates a command signal for maintaining a gap amount at a constant value, based on the unit vector, and the gap amount between a machining nozzle and a workpiece. With a servo control unit, on the basis of the command signal, an X-axis motor, a Y-axis motor, and a Z-axis motor are controlled, whereby the machining nozzle is moved relatively in three-dimensional directions with respect to the workpiece.

LASER MACHINING DEVICE AND LASER MACHINING METHOD
20170304937 · 2017-10-26 ·

A unit vector calculating unit of a laser machining device obtains a unit vector based on respective current rotational positions of an A-axis and a B-axis. A movement command calculating unit, a speed command calculating unit, or a torque command calculating unit generates a command signal for maintaining a gap amount at a constant value, based on the unit vector, and the gap amount between a machining nozzle and a workpiece. With a servo control unit, on the basis of the command signal, an X-axis motor, a Y-axis motor, and a Z-axis motor are controlled, whereby the machining nozzle is moved relatively in three-dimensional directions with respect to the workpiece.

LASER PEENING PROCESSING DEVICE AND LASER PEENING PROCESSING METHOD
20170282298 · 2017-10-05 ·

According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

LASER PEENING PROCESSING DEVICE AND LASER PEENING PROCESSING METHOD
20170282298 · 2017-10-05 ·

According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

MEDICAL SYRINGE, GASKET TO BE USED FOR SYRINGE, AND GASKET PRODUCTION METHOD

Laminated gasket free from liquid drug leakage. A gasket (13) for a medical syringe, with main body (14) made of elastic material, and film (15) provided on a surface of main body (14). Gasket (13) has a circumferential surface portion (17) for contact with an inner peripheral surface of a syringe barrel (11) and an annular groove (22) formed circumferentially in a surface portion of the film in the circumferential surface portion thereof. Annular groove (22) has outer edge portions (24) provided along opposite edges (23) thereof as projecting from an unprocessed surface portion of the film. Annular groove (22) has a groove formation start point and a groove formation end point connected to each other in a groove connection region. Outer edge portions (24) provided along the opposite edges of the annular groove have a maximum-to-minimum height difference of μm in the groove connection region.

LASER PROCESSING METHOD AND LASER PROCESSING SYSTEM

A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position.

Laser welding machine and laser welding method using the same

A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.

INVISIBLE LASER SYSTEM AND OPTICAL PATH VISUALIZATION METHOD THEREOF
20170225267 · 2017-08-10 ·

An invisible laser system and an optical path visualization method thereof are disclosed. The invisible laser system comprises an invisible laser light generator for generating invisible laser light; a visible light generator for generating visible light; and an optical path visualization component arranged in optical paths of the invisible and visible light, and comprising a first and second incident end and a first outgoing end. The invisible laser light is incident on the first incident end, and the visible light is incident on the second incident end. All of the invisible laser light and at least part of the visible light are emitted in parallel with each other at the first outgoing end. All of the invisible laser light is present in a direction parallel with the optical path of the visible light, and no invisible laser light is present in other directions, so radiation risks are eliminated.

INVISIBLE LASER SYSTEM AND OPTICAL PATH VISUALIZATION METHOD THEREOF
20170225267 · 2017-08-10 ·

An invisible laser system and an optical path visualization method thereof are disclosed. The invisible laser system comprises an invisible laser light generator for generating invisible laser light; a visible light generator for generating visible light; and an optical path visualization component arranged in optical paths of the invisible and visible light, and comprising a first and second incident end and a first outgoing end. The invisible laser light is incident on the first incident end, and the visible light is incident on the second incident end. All of the invisible laser light and at least part of the visible light are emitted in parallel with each other at the first outgoing end. All of the invisible laser light is present in a direction parallel with the optical path of the visible light, and no invisible laser light is present in other directions, so radiation risks are eliminated.

Laser cutting processing method
11235425 · 2022-02-01 · ·

At a time of carrying out a laser cutting processing in a direction intersecting with a processing line at which the laser cutting processing for a work has been carried out, a laser cutting speed is decelerated before a laser beam reaches the processing line at an initial laser cutting speed, and the laser cutting speed is accelerated when an axial center of the laser beam is positioned within a prescribed range in vicinity of a central position of the processing line, and the laser cutting speed is returned to the initial laser cutting speed, in vicinity of a position at which the axial center of the laser beam crosses the processing line. Also, when the axial center of the laser beam and the central position of the processing line almost coincide, the laser output is made to be almost zero.