This disclosure refers to a method for confectioning resistors that each comprise a PTC ceramic plate and metallic electrode layers covering opposite faces of the ceramic plate, said method comprising the following steps: measuring an electrical resistance of a resistor to be confectioned by applying an electrical potential to one of electrode layers such that an electric current flows from one of the electrode layers through the ceramic plate to the electrode layer on the opposite face of the ceramic plate, comparing the measured resistance to a target resistance, and removing, if the measured resistance is lower than the target resistance, a section of at least one of the electrode layers. This disclosure also refers to such a resistor and a heating device comprising such resistors.

This disclosure refers to a method for confectioning resistors that each comprise a PTC ceramic plate and metallic electrode layers covering opposite faces of the ceramic plate, said method comprising the following steps: measuring an electrical resistance of a resistor to be confectioned by applying an electrical potential to one of electrode layers such that an electric current flows from one of the electrode layers through the ceramic plate to the electrode layer on the opposite face of the ceramic plate, comparing the measured resistance to a target resistance, and removing, if the measured resistance is lower than the target resistance, a section of at least one of the electrode layers. This disclosure also refers to such a resistor and a heating device comprising such resistors.

A laser printhead assembly for a laser printhead is disclosed herein. The laser printhead assembly may include a laser containment door; and a laser containment housing that is configured to form a sealed enclosure with a label support of a rewriteable label. The sealed enclosure may be configured to include the rewriteable label and the laser printhead. The laser containment door, in a laser-enabled position, may be configured to permit the laser printhead, via a light beam, to modify the rewriteable label and the laser containment door, in a laser-disabled position, may be configured to prevent a light beam from escaping the laser containment housing.

A laser printhead assembly for a laser printhead is disclosed herein. The laser printhead assembly may include a laser containment door; and a laser containment housing that is configured to form a sealed enclosure with a label support of a rewriteable label. The sealed enclosure may be configured to include the rewriteable label and the laser printhead. The laser containment door, in a laser-enabled position, may be configured to permit the laser printhead, via a light beam, to modify the rewriteable label and the laser containment door, in a laser-disabled position, may be configured to prevent a light beam from escaping the laser containment housing.

A transparent pane is described, having an electrical heating layer extending at least over part of the pane surface and divided into a main heating region and an additional heating region electrically insulated therefrom. The transparent pane has connection means, which can be electrically connected to a voltage source and which has at least a first collecting conductor and a second collecting conductor. The collecting conductors are each electrically connected to the heating layer in the main heating region in direct contact such that upon application of a supply voltage, a heating current flows across a heating field formed by the heating layer. The transparent pane has at least one electrical line heating element, which is arranged, at least in sections, in the additional heating region of the heating layer.

A transparent pane is described, having an electrical heating layer extending at least over part of the pane surface and divided into a main heating region and an additional heating region electrically insulated therefrom. The transparent pane has connection means, which can be electrically connected to a voltage source and which has at least a first collecting conductor and a second collecting conductor. The collecting conductors are each electrically connected to the heating layer in the main heating region in direct contact such that upon application of a supply voltage, a heating current flows across a heating field formed by the heating layer. The transparent pane has at least one electrical line heating element, which is arranged, at least in sections, in the additional heating region of the heating layer.

A method for manufacturing an organic electro-luminescent (EL) element includes: a first process of preparing an organic EL element which includes a positive electrode, an organic layer which includes a light-emitting layer, and a negative electrode, the organic EL element having a short-circuited portion where the positive electrode and the negative electrode are short-circuited; and a second process of emitting femtosecond laser light to at least one of: the transparent electrically conductive material layer and the metal layer in a short-circuited portion; and the transparent electrically conductive material layer and the metal layer around the short-circuited portion to bring the transparent electrically conductive material layer and the metal layer into high-resistance states.

A laser oscillator of a laser processing apparatus generates burst pulses each composed of a plurality of sub-pulses. The plurality of sub-pulses are generated in such a manner that the energy of the sub-pulse sequentially changes from a lower energy to a higher energy, and the burst pulses are applied to a wafer, whereby the wafer is formed therein with shield tunnels extending from the front surface to the back surface of the wafer and each being composed of a minute hole and an amorphous phase surrounding the minute hole.

A laser oscillator of a laser processing apparatus generates burst pulses each composed of a plurality of sub-pulses. The plurality of sub-pulses are generated in such a manner that the energy of the sub-pulse sequentially changes from a lower energy to a higher energy, and the burst pulses are applied to a wafer, whereby the wafer is formed therein with shield tunnels extending from the front surface to the back surface of the wafer and each being composed of a minute hole and an amorphous phase surrounding the minute hole.

Reliable coupling of a high-power laser beam into a liquid-jet in a liquid-jet guided laser system can be achieved with high lifetime performance of the nozzle and the protection window, through setting the parameters of the liquid-jet guided laser system according to an optimum relationship that links the focus point of the laser, the focus cone angle, the laser beam energy distribution profile and the nozzle geometry.