A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.

A laser printhead assembly for a laser printhead is disclosed herein. The laser printhead assembly may include a laser containment door; and a laser containment housing that is configured to form a sealed enclosure with a label support of a rewriteable label. The sealed enclosure may be configured to include the rewriteable label and the laser printhead. The laser containment door, in a laser-enabled position, may be configured to permit the laser printhead, via a light beam, to modify the rewriteable label and the laser containment door, in a laser-disabled position, may be configured to prevent a light beam from escaping the laser containment housing.

A laser printhead assembly for a laser printhead is disclosed herein. The laser printhead assembly may include a laser containment door; and a laser containment housing that is configured to form a sealed enclosure with a label support of a rewriteable label. The sealed enclosure may be configured to include the rewriteable label and the laser printhead. The laser containment door, in a laser-enabled position, may be configured to permit the laser printhead, via a light beam, to modify the rewriteable label and the laser containment door, in a laser-disabled position, may be configured to prevent a light beam from escaping the laser containment housing.

A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 μm and 10 m. The dielectric workpiece can have a specially formed edge.

A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 μm and 10 m. The dielectric workpiece can have a specially formed edge.

A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.

A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.

A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.